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Electronic assemblies with flexible terminals

A technology of electronic components and terminals, applied in the direction of electrical components, electrical solid devices, climate sustainability, etc., can solve problems such as damage to the electrical characteristics of chip components

Active Publication Date: 2022-06-07
VISHAY ISRAEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This impairs the electrical characteristics of chip components compared to chip components where current flows only through the metal parts of the terminals

Method used

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  • Electronic assemblies with flexible terminals
  • Electronic assemblies with flexible terminals
  • Electronic assemblies with flexible terminals

Examples

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Embodiment Construction

[0038] The drawings and the following description use reference numerals (same reference numerals or incremented by 100) for components that are common to the various examples.

[0039] Figures 1A to 1C A partial cross-sectional view is shown through an electronic assembly including a chip body 102 and chip terminals for soldering the chip body 102 to a carrier (eg, a circuit board or PCB), the chip terminals being Figure 1B and 1C Pads 118 in are shown schematically. The electronic component of FIG. 1 has three sides of metal, so the chip terminal includes a lower electrode 104 , an upper electrode 106 , and a front side metal 108 that electrically connects the upper and lower electrodes 104 , 106 . The notation “upper” refers to the side away from the carrier from the chip body 102 , and “lower” refers to the side of the chip body 102 facing the carrier. Similarly, although FIG. 1 shows only a partial cross-sectional view of the assembly, it should be understood that th...

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Abstract

The present invention provides an electronic assembly comprising a body and at least one terminal for soldering the body to the carrier, the terminal comprising: an electrode disposed on the surface of the body; formed on the electrode and / or formed by the a gas release layer surrounding the electrode, wherein the gas release layer is configured to release gas when heated; and a conductive cover layer formed on the gas release layer, wherein the cover layer is electrically connected to the electrode and is The gas release layer is hermetically sealed between the cover layer and the electrode in an airtight manner.

Description

technical field [0001] The present invention relates to an electronic assembly comprising a body and at least one terminal for soldering the body to a carrier, such as an electronic chip-type assembly. Background technique [0002] Active and passive electronic chip-type assemblies are commonly used in electronic devices. The vast majority of modern passive components, such as resistors, capacitors, inductors, thermistors, varistors, and fuses, are leadless chip components consisting of either a rigid ceramic parallelepiped formed with metallized ends. chip body. The metallized ends serve as terminals for components and are soldered to a carrier, such as a printed circuit board (PCB). For example, the terminal ends on one, three or five sides of the chip body of the chip may be metallized. [0003] Although leadless chip assemblies are smaller and have higher bandwidth and lower price than traditional leaded assemblies with leads and stamped terminals, they can also form ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H01G4/30H01G4/232H01L23/498
CPCH01G4/30H01G2/065H01G4/2325H01L23/49805H01L23/49811H01L23/49888H05K3/3431H05K3/3442H05K2201/10015H05K2201/10636H05K2201/10651Y02P70/50B23K1/0016H01G4/248B23K2101/36B23K2103/52H01R12/57H05K1/181
Inventor 迈克尔·贝尔曼
Owner VISHAY ISRAEL