Clamping device applied to sputtering coating equipment, and sputtering coating equipment

Abstract

The invention discloses a clamping device applied to sputtering coating equipment, and the sputtering coating equipment. The clamping device comprises a clamp and a driving device, wherein the clamp is used for correspondingly clamping a substrate and a mask, and the driving device is connected with the clamp and is used for driving the clamp to clamp or release the substrate and the mask; an opening which is matched with an opening of the mask in shape and size is formed in the clamp, so that after the clamp clamps the mask and the substrate, the orthographic projection of the mask on the substrate is completely covered with the orthographic projection of the side, close to the mask, of the clamp on the substrate; and the opening of the clamp communicates with the opening of the mask in an aligned mode, so that a sputtering coating area of the substrate is exposed to be sputtering-coated by the sputtering coating equipment. By adoption of the clamping device applied to the sputteringcoating equipment, and the sputtering coating equipment, the mask can be prevented from being covered by a sputtering coating in the sputtering coating process of the substrate, so that buckling deformation of the mask, contamination of the sputtering coating falling off from the mask to a sputtering coating cavity, and coating shadows of the substrate are avoided.

Description

technical field [0001] The present application relates to the technical field of sputtering coating equipment, in particular to a clamping device and sputtering equipment used in sputtering equipment. Background technique [0002] Sputtering coating machines are widely used in the coating process of TP (Touch Panel, touch screen), LCD (Liquid Crystal Display, liquid crystal display), OLED (Organic Light-Emitting Diode, organic light-emitting diode), and the substrate is required for sputtering coating The carrier device, the substrate carrier device is equipped with a substrate fixing device; there are many film forming processes that do not require the entire substrate to be filmed, but need to deposit a film of a specific shape, which requires the use of metal masks and sputtering coatings. Its supporting tight alignment system must ensure that the relative position between the metal mask and the substrate remains unchanged during the film forming process in order to produ...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a clamping device and sputtering equipment used in sputtering equipment to solve the warping and deformation of the mask during the substrate sputtering film formation process, and the sputtered film layer on the mask falls off and pollutes the sputtering. The problem of shadows in the plating chamber and substrate film formation

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