An integrated circuit chip package structure and its welding process manufactured by ultrasonic waves

Abstract

The invention relates to the technical field of integrated circuit equipment, and discloses an integrated circuit chip packaging structure manufactured by using ultrasonic copper wires; the integratedcircuit chip packaging structure comprises a frame, wherein the frame is connected with a substrate; the substrate is connected with a chip through an adhesive layer; and two rows of uniformly distributed welding discs are arranged at the upper end of the chip. According to the integrated circuit chip packaging structure manufactured through the ultrasonic copper wires, adjacent welding copper balls are located on the two sides of a welding gold ball respectively, and a first pin and an extension pin are arranged at intervals and are sequentially connected with the corresponding welding copper balls, so that the adjacent bonding copper wires are distributed in a large radian and a small radian in sequence, and the distance between the adjacent copper wires is increased; meanwhile, the welding copper balls are connected with the welding discs through the welding gold ball, and due to the property of the gold material relative to the copper, the influence on the substrate and a siliconwafer is small by taking gold as the medium to be connected with the substrate, and the reliability of the chip is improved; and in addition, the influence on the surrounding metal layer is small, theheat cycle effect of the chip is facilitated, and the heat dissipation efficiency of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit equipment, in particular to an integrated circuit chip packaging structure manufactured by ultrasonic waves and a welding process thereof. Background technique [0002] see figure 1 , the integrated circuit chip is provided with a shell outside, which plays the role of placing, fixing, sealing, protecting the chip and enhancing thermal conductivity. There are evenly distributed pins on the shell, and the pins and the chip are connected by wires. Make connections with the printed circuit of the board. [0003] With the development of chip technology, the number of pins increases, and the wires connected between the pins and the chip in the package become more and more dense. It is easy to damage the previous one first, which reduces the yield rate of the produced products. On the other hand, the welding copper balls of the soldering points are easy to exceed the pads, causing short cir...

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Problems solved by technology

[0003] With the development of chip technology, the number of pins increases, and the wires connected between the pins and the chip in the package become more and more dense. It is easy to damage the previous one first, which reduces the yield rate of the produced products. On the other hand, the welding copper balls of the soldering points are easy to exceed the pads, causing short circuits between adjacent soldering points. In order not to reduce the connection between the copper wire and the copper balls Density increases the spacing between adjacent copper wires and adjacent soldering copper balls at the same time. In the prior art, gold balls are arranged at intervals between the soldering copper balls and the pads. Since the diameter of the soldering gold balls is required to be smaller than the copper balls, the distance between the gold balls The distance between adjacent copper balls is large, and there is a level difference between the connecting copper wire and the soldered copper balls, and the distance is also increased, which reduces the difficulty of the manufacturing process and improves the yield of the finished product, but due to the level of the solder balls The height is different, the force is uneven, and the force is uneven when using ultrasonic welding, and the use of ultrasonic welding requires high control precision. If it is too low, the welding is not reliable, and if it is too high, it will damage the substrate and dielectric

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