Lapping device, lapping method and wafer

Abstract

The invention provides a lapping device, a lapping method and a wafer. The lapping device comprises an upper fixed disc, a lower fixed disc, a wafer carrier and a driving mechanism; the wafer carrieris arranged between the upper fixed disc and the lower fixed disc, a plurality of wafer carrier holes are formed in the wafer carrier, and to-be-lapped components are borne in the wafer carrier holes;the wafer carrier is driven by the driving mechanism to carry out self-rotation around the axis of the wafer carrier, and carries out revolution around the center of the lower fixed disc so as to move relative to the upper fixed disc and the lower fixed disc to lap the to-be-lapped components; an edge guide ring is arranged in each carrier wafer hole, and one to-be-lapped component is arranged ineach edge guide ring in a sleeved mode and is arranged in the corresponding wafer carrier hole in a manner of being freely moved relative to the wafer carrier hole so as to drive the edge guide ringto move when the to-be-lapped component moves in the lapping process. According to the lapping device, the lapping method and the wafer, mechanical damage collision of the relatively fragile edge parts of the surfaces of the to-be-lapped components such as the wafer can be minimized, and furthermore, the occurrence rate of the broken to-be-lapped components and chip defects caused by mechanical damage and collision can be reduced.

Description

technical field [0001] The invention relates to the field of semiconductor material manufacturing, in particular to a grinding device, a grinding method and a wafer. Background technique [0002] As a material for manufacturing semiconductor elements, silicon wafers (Si wafers) are widely used. A silicon wafer is a wafer in which the same type of silicon is grown on the silicon surface. Silicon wafers are widely used because they are excellent in the purity and crystallization properties of regions where semiconductors are integrated, and are beneficial to the yield and device characteristics of semiconductor devices. [0003] Generally, the wafer manufacturing process can be roughly divided into slicing, edge grinding, lapping, caustic etching, double side grinding, double side polishing ( Double side polishing), edge polishing (edge ​​polishing), final polishing (final polishing) and other processes. Among them, in the slicing process, the grown cylindrical silicon sing...

AI Technical Summary

Problems solved by technology

Although the occurrence of wafer broken and chip defects in the lapping process is reduced in this way, the resin layer is fixed in the hole of the carrier plate, and the wafer is relatively in the hole of the carrier plate during the lapping process. The resin layer will also move up, down, left, and right linearly, and there is still a phenomenon that the grinding damage of the wafer edge is relatively fragile

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