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Optical transmittance assessment method and device and photovoltaic chip packaging design method

A photovoltaic chip and design method technology, applied in the field of solar cells, can solve the problems of high R&D and testing costs, and achieve the effect of reducing R&D and testing costs and shortening the R&D cycle

Pending Publication Date: 2019-08-30
鸿翌科技有限公司
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  • Application Information

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Problems solved by technology

However, the development and testing costs of this method are relatively high
[0004] Moreover, since the light transmittance design of lamination and packaging materials of crystalline silicon photovoltaic modules is relatively fixed and mature, thin-film photovoltaic modules and supporting packaging materials are relatively new. Experimental testing method, the cost of R&D testing is higher

Method used

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  • Optical transmittance assessment method and device and photovoltaic chip packaging design method

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Embodiment Construction

[0027] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0028] Such as figure 1 As shown, an optical transmittance evaluation method provided by an embodiment of the present invention may include the following steps:

[0029] S110: For the package combination of the photovoltaic chip to be evaluated, obtain the package parameters of the package combination.

[0030] Among ...

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Abstract

The invention discloses an optical transmittance assessment method and device and a photovoltaic chip packaging design method, and the method comprises the steps: obtaining the packaging parameters ofa to-be-assessed photovoltaic chip packaging combination; according to a pre-constructed optical transmittance assessment model and the packaging parameters of the packaging combination, assessing the optical transmittance of the packaging combination in the absorption spectrum section of the photovoltaic chip; wherein the packaging parameters of the packaging combination comprise the material ofeach packaging layer in the packaging combination and the thickness of each packaging layer in the packaging combination. Through the scheme of the invention, the assessment of the optical transmittance of the packaging combination in the absorption spectrum section of the photovoltaic chip can be simply and conveniently realized, and a basis can be provided for finding an appropriate packaging combination in the initial design stage, so that the research and development test cost and the research and development period of a photovoltaic product are reduced.

Description

Technical field [0001] The present invention relates to the technical field of solar cells, in particular to an optical transmittance evaluation method, device and photovoltaic chip packaging design method. Background technique [0002] Solar cell, also known as "solar chip" or "photovoltaic chip", is a kind of optoelectronic semiconductor sheet that directly converts light energy into electrical energy through photoelectric effect or photochemical effect; the photovoltaic chip is packaged by various materials, which can be applied to Solar photovoltaic modules in various occasions. [0003] Crystalline silicon solar power technology and thin film solar power technology are the core technologies of solar cells. Thin-film photovoltaic modules are international emerging technologies. Thin-film photovoltaic modules have the characteristics of thin thickness and light weight that are different from crystalline silicon photovoltaic modules. The current optical transmittance evaluation...

Claims

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Application Information

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IPC IPC(8): G06F17/50G06Q10/06G06Q50/04H01L31/048
CPCG06Q10/0639G06Q50/04H01L31/048G06F30/398G06F2113/18Y02P90/30
Inventor 杨晨张天水
Owner 鸿翌科技有限公司
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