Turret type chip braiding machine

Abstract

The invention discloses a turret type chip braiding machine, and relates to the field of chip processing. The turret type chip braiding machine comprises a feeding and discharging system, a correctioncompensation system, a take-and-place system, a braiding sealing system and a detection system, wherein the feeding and discharging system is used for conveying a wafer plate with chips loaded to a designated position and resetting the vacant wafer plate so as to allow the chips to be loaded, the correction compensation system is used for grabbing the wafer plate and finely adjusting the positionof the wafer plate, the take-and-place system is used for picking up and conveying the chips on the wafer plate for transferring of the chip positions, the braiding sealing system is used for receiving the chips conveyed by the take-and-place system for braiding packaging, and the detection system is used screening out good products and defective products in the chips and removing the defective chips in the chips. According to the turret type chip braiding machine, a multi-swing arm and multi-suction nozzle structure is adopted so that wafers can be continuously and accurately taken from theinterior of the blue film wafer plate and can be accurately placed into a carrying tape for braiding packaging at the same time, then high-speed surface mounting of high-speed space transferring of the chips is realized, and the labor is greatly saved.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to a turret type chip braiding machine. Background technique [0002] Traditional die-bonding machine equipment adopts a single swing arm and single suction nozzle structure. Due to the limitation of the mechanical structure of the equipment and its operating accuracy, it is impossible to transfer the picked-up chips to the tape package; however, the conventional tape machine is due to the mechanical structure Due to the limitations of the manufacturing process, it is impossible to capture chip products. With the development of semiconductor chips (LED) and the country's strong support for the semiconductor industry, the market's demand for semiconductor chip (LED) packaging equipment is increasing, and the appearance of chips (LED) is becoming smaller or smaller. Ultra-miniaturization, this has given birth to some products that carry out tape packaging on chips, and its production p...

AI Technical Summary

Problems solved by technology

Some companies produce by manual transfer, which has low precision and efficiency, and brings difficulties to the next packaging process, affecting the packaging quality

It can only be applied to some equipment with low precision and speed requirements, but it cannot meet the high-speed, high-precision, and high-reliability chip packaging product manufacturing process requirements; however, the equipment imported from abroad is expensive, and the initial investment for small and medium-sized enterprises is large. , seriously restricting the development of SMEs

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