Unlock instant, AI-driven research and patent intelligence for your innovation.

Method of processing a substrate and substrate carrier for holding a substrate

A substrate carrier and substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve the problem of mask substrate positioning and increase processing complexity, etc.

Active Publication Date: 2019-09-03
APPLIED MATERIALS INC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, additional mechanisms are often required to hold the mask in front of the substrate during deposition, which can add to processing complexity and can lead to mask and / or substrate positioning issues
For example, accurate three-dimensional positioning of the mask in front of the substrate at a short distance from the substrate without damaging the substrate can be very challenging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of processing a substrate and substrate carrier for holding a substrate
  • Method of processing a substrate and substrate carrier for holding a substrate
  • Method of processing a substrate and substrate carrier for holding a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the accompanying drawings. The embodiments are provided by way of explanation of the present invention, and are not meant to be limiting. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield a further embodiment. The present disclosure is intended to cover such modifications and variations.

[0021] In the following description of the drawings, the same reference numerals denote the same or similar components. In general, only the differences of individual implementations are described. Unless otherwise specified, descriptions of a part or aspect in one embodiment are also applicable to corresponding parts or aspects in another embodiment.

[0022] figure 1 Stages (a) to (d) during processing of a substrate 10 according to embodiments described herein are schematically shown...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method of processing a substrate (10) is described. The method includes attracting a substrate (10) to a support surface (102) of a substrate carrier (100) with a chucking device (120), arranging amask (20) in front of the substrate (10), partially releasing the substrate (10) from the support surface (102), and depositing a material (105) on the substrate (10). According to a further aspect, asubstrate carrier (100) for holding a substrate during deposition is described. The substrate carrier includes a chucking device (120) configured for attracting a substrate (10) toward a support surface (102) of the substrate carrier (100), wherein the chucking device (120) is configured to partially release the substrate (10) from the support surface (102).

Description

technical field [0001] Embodiments of the present disclosure relate to methods of processing substrates. More specifically, the present disclosure relates to the deposition of materials on a substrate in a vacuum chamber while the substrate is held on a support surface of a substrate carrier. Additional embodiments relate to a substrate carrier for holding a substrate, in particular to a substrate carrier having a clamping assembly configured to hold the substrate while depositing material on the substrate in a vacuum chamber. Background technique [0002] Optoelectronic devices using organic materials are becoming increasingly popular for a number of reasons. Many of the materials used to make such devices are relatively inexpensive, so organic optoelectronic devices have the potential for cost advantages over inorganic devices. Inherent properties of organic materials, such as their flexibility, can be advantageous for applications such as deposition on flexible or infle...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/683H01L21/30H01L21/687H01L21/677
CPCH01L21/67748H01L21/6831H01L21/6833H01L21/68728H01L21/68735H01L21/68778H01L21/30
Inventor 马蒂亚斯·赫曼尼斯
Owner APPLIED MATERIALS INC