Chip packaging system

A packaging system and chip technology, applied in packaging, transportation, packaging, closing, etc., can solve problems such as danger, artificial fire, etc., and achieve the effects of preventing accidental injuries, convenient operation, and simple structure
CN110203544AActive Publication Date: 2019-09-06浙江麦知网络科技有限公司
7 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
浙江麦知网络科技有限公司
Publication Date
2019-09-06

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a chip packaging system. The chip packaging system comprises a packaging machine, wherein a packaging cavity is formed in the packaging machine; a clamping reversing device isarranged on the upper side of the packaging cavity; the clamping reversing device comprises a lifting plate arranged on the upper side in the packaging cavity; a steering wheel is rotatably arranged on the lower side of the lifting plate and is driven to lift by controlling the lifting plate and then is controlled to reverse; a control turntable is rotatably arranged in the steering wheel; slidingplates are symmetrically arranged on the lower side of the control turntable back and forth; and the sliding plates are controlled to approach and move away from each other through the control turntable. According to the chip packaging system, a plastic packaging belt can be plastically packaged through flame spraying, and meanwhile, automatic reversing can be achieved; work of the last procedures can be directly connected, the chip packaging system is quicker and labor-saving; and accidental damage caused by flame spraying can be prevented, and the chip packaging is safer and more reliable.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of packaging and processing, in particular to a chip packaging system. Background technique

[0002] Chips need to be packaged when they are sold. At present, most of them are packaged in plastic. In order to ensure that the plastic is not easy to break, thicker plastic packaging is used. For thicker plastic, it needs to be sealed in the form of heating between high temperature and fire, but Many of them are plastic-packed by artificial flame spraying, which is extremely dangerous. Therefore, a chip packaging system is urgently needed to improve the efficiency of chip packaging. Contents of the invention

[0003] The object of the present invention is to provide a chip packaging system for overcoming the above-mentioned defects in the prior art.

[0004] A chip packaging system according to the present invention includes a packing machine, a packing cavity is arranged inside the packing machine, a clampin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More