Chip packaging system

A packaging system and chip technology, applied in packaging, transportation, packaging, closing, etc., can solve problems such as danger, artificial fire, etc., and achieve the effects of preventing accidental injuries, convenient operation, and simple structure

Active Publication Date: 2019-09-06
浙江麦知网络科技有限公司
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Chips must be packaged when they are sold. At present, most of them are packaged in plastic. In order to ensure that the plastic is not easy to break, thicker plastic packaging is used. For thicker plastic packaging, it needs to be sealed in the form of heating between high temperature fires, but Many of them are plastic-packed by artificial fire spraying, which is extremely dangerous. Therefore, a chip packaging system is urgently needed to improve the efficiency of chip packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip packaging system
  • Chip packaging system
  • Chip packaging system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Combine below Figure 1-6 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0017] refer to Figure 1-6 , a chip packaging system according to an embodiment of the present invention, comprising a packing machine 11, a packing chamber 12 is arranged inside the packing machine 11, a clamping and reversing device is provided on the upper side of the packing chamber 12, and the clamping The reversing device includes a lifting plate 13 arranged on the upper side of the packing cavity 12, and a steering wheel 14 is rotatably arranged on the lower side of the lifting plate 13, and the steering wheel 14 is driven up and down by controlling the lifting plate 13, Then control the steering wheel 14 to change direction, the steering wheel 14 is rotatably provided with a c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a chip packaging system. The chip packaging system comprises a packaging machine, wherein a packaging cavity is formed in the packaging machine; a clamping reversing device isarranged on the upper side of the packaging cavity; the clamping reversing device comprises a lifting plate arranged on the upper side in the packaging cavity; a steering wheel is rotatably arranged on the lower side of the lifting plate and is driven to lift by controlling the lifting plate and then is controlled to reverse; a control turntable is rotatably arranged in the steering wheel; slidingplates are symmetrically arranged on the lower side of the control turntable back and forth; and the sliding plates are controlled to approach and move away from each other through the control turntable. According to the chip packaging system, a plastic packaging belt can be plastically packaged through flame spraying, and meanwhile, automatic reversing can be achieved; work of the last procedures can be directly connected, the chip packaging system is quicker and labor-saving; and accidental damage caused by flame spraying can be prevented, and the chip packaging is safer and more reliable.

Description

technical field [0001] The invention relates to the technical field of packaging and processing, in particular to a chip packaging system. Background technique [0002] Chips need to be packaged when they are sold. At present, most of them are packaged in plastic. In order to ensure that the plastic is not easy to break, thicker plastic packaging is used. For thicker plastic, it needs to be sealed in the form of heating between high temperature and fire, but Many of them are plastic-packed by artificial flame spraying, which is extremely dangerous. Therefore, a chip packaging system is urgently needed to improve the efficiency of chip packaging. Contents of the invention [0003] The object of the present invention is to provide a chip packaging system for overcoming the above-mentioned defects in the prior art. [0004] A chip packaging system according to the present invention includes a packing machine, a packing cavity is arranged inside the packing machine, a clampin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B65D51/10B65B35/24
CPCB65B35/24B65D51/10
Inventor 陈相忠
Owner 浙江麦知网络科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap