Molding processing technology of circuit board

A technology for forming and processing circuit boards, which is applied in the processing of insulating substrates/layers, printed circuits, and printed circuit manufacturing. The effect of convenient maintenance and convenient operation

Active Publication Date: 2019-09-06
LONGNAN JUNYA ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic technology, the demand for circuit boards is also increasing. However, there are many steps in the forming process of circuit boards, and the production is complicated. In the process of circuit board production, the adjacent operation steps are incoherent and the work efficiency is low. The cost is relatively high, therefore, the present invention aims to design a two-step circuit board forming processing equipment and its processing technology that can work continuously

Method used

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  • Molding processing technology of circuit board
  • Molding processing technology of circuit board
  • Molding processing technology of circuit board

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the above-mentioned diagrams, wherein, for the convenience of description, the orientations mentioned below are defined as follows: the front, back, left, and right and figure 1 The up and down directions of the projection relationship are the same.

[0023] Such as Figure 1-6 As shown, a circuit board forming process of the present invention, wherein the equipment includes a main body 11, a cutting chamber 34 is provided in the main body 11, a cutting device 100 is provided in the cutting chamber 34, and the cutting chamber 34 The left wall is provided with a main cavity 15, the cutting cavity 34 is provided with a conveying device 200, the cutting cavity 34 right wall is provided with a grinding cavity 99 communicating with the cutting cavity 34, and the grinding cavity 99 is provided with a grinding cavity 99. There is a grinding device 300, the grinding chamber 99 is provided with a clampi...

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Abstract

The invention discloses a molding processing technology of a circuit board. Equipment used in the technology comprises a main body, a cutting cavity is formed in the interior of the main body, the cutting cavity is internally provided with a cutting device, a main cavity is formed in the interior of the left wall of the cutting cavity, the cutting cavity is internally provided with a conveying device, a polishing cavity communicated with the cutting cavity is formed in the interior of the right wall of the cutting cavity, the polishing cavity is internally provided with a polishing device, thepolishing cavity is internally provided with a clamping device, and the main cavity is internally provided with a power device. The equipment is simple in structure, convenient in operation and convenient in maintenance, and the equipment can operate uninterruptedly for cutting operation and polishing operation, the operation time of the circuit board is reduced, the molding processing efficiencyof the circuit board is improved, and the production cost of the circuit board is reduced, so that the equipment has preferable application and popularization values.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a circuit board forming process. Background technique [0002] With the development of electronic technology, the demand for circuit boards is also increasing. However, there are many steps in the forming process of circuit boards, and the production is complicated. In the process of circuit board production, the adjacent operation steps are incoherent and the work efficiency is low. The cost is relatively high. Therefore, the present invention aims to design a two-step circuit board forming and processing equipment and its processing technology that can work continuously. Contents of the invention [0003] The object of the present invention is to provide a kind of circuit board molding processing technology, can overcome the above-mentioned defective of prior art. [0004] According to a circuit board forming process of the present invention, the equipment used in thi...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K3/0052
Inventor 不公告发明人
Owner LONGNAN JUNYA ELECTRONICS TECH CO LTD
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