A flexible printed circuit board substrate with improved bonding performance between PI film and CU foil
A flexible printed circuit, bonding performance technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problem of unsatisfactory bonding performance between polyimide film and copper foil, and achieve improved adhesion The effect of knot properties
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Embodiment 1
[0033] The flexible printed circuit board substrate includes the following raw materials in parts by weight: 21.5g 4,4'-diaminodiphenyl sulfide (SDA), 22.5g pyromellitic anhydride (PMDA), 440g N,N'-dimethyl Formamide (DMF), 2g polyvinyl alcohol (PVA), 10mL deionized water, Cu foil (thickness 0.7mm, width 100mm, length 100mm);
[0034] The preparation method of the above-mentioned flexible printed circuit board base material comprises the following steps:
[0035] (1) Equipped with electromagnetic stirring, thermometer and N 2 Add 21.5g4,4'-diaminodiphenyl sulfide (SDA) in the reactor of the protective device, and at 120rpm, add 10gN,N'-dimethylformamide (DMF) into the reactor, and convert to Stir for 20min at 200rpm;
[0036] (2) Add 22.5g of pyromellitic anhydride (PMDA) into the reactor three times at a rotating speed of 120rpm, and rinse the inner wall of the reactor with 10g of N,N'-dimethylformamide (DMF) after each addition ;
[0037] (3) Afterwards, at a rotating sp...
Embodiment 2
[0042] The flexible printed circuit board substrate includes the following raw materials in parts by weight: 21.5g 4,4'-diaminodiphenyl sulfide (SDA), 25g pyromellitic anhydride (PMDA), 450g N,N'-dimethylformaldehyde Amide (DMF), 5g polyvinyl alcohol (PVA), 30mL deionized water, Cu foil (thickness 0.7mm, width 100mm, length 100mm);
[0043] The preparation method of the above-mentioned flexible printed circuit board base material comprises the following steps:
[0044] (1) Equipped with electromagnetic stirring, thermometer and N 2 Add 21.5g4,4'-diaminodiphenyl sulfide (SDA) in the reactor of the protective device, and at 150rpm, add 10gN,N'-dimethylformamide (DMF) to the reactor, and convert to Stir for 40min at 300rpm;
[0045] (2) Add 25 g of pyromellitic anhydride (PMDA) into the reactor three times at a rotating speed of 150 rpm, and rinse the inner wall of the reactor with 10 g of N,N'-dimethylformamide (DMF) after each addition;
[0046] (3) Afterwards, at a rotating s...
Embodiment 3
[0051] The flexible printed circuit board substrate includes the following raw materials in parts by weight: 23g of 4,4'-diaminodiphenyl sulfide (SDA), 25g of pyromellitic anhydride (PMDA), 500g of N,N'-dimethylformamide (DMF), 8g polyvinyl alcohol (PVA), 50mL deionized water, Cu foil (thickness 0.7mm, width 100mm, length 100mm);
[0052] The preparation method of the above-mentioned flexible printed circuit board base material comprises the following steps:
[0053] (1) Equipped with electromagnetic stirring, thermometer and N 2 Add 23g of 4,4'-diaminodiphenylsulfide (SDA) to the reactor of the protection device, and add 10g of N,N'-dimethylformamide (DMF) to the reactor at a speed of 180rpm, and turn it to 300rpm Stir for 60min;
[0054] (2) Add 25 g of pyromellitic anhydride (PMDA) into the reactor three times at a rotating speed of 180 rpm, and rinse the inner wall of the reactor with 10 g of N,N'-dimethylformamide (DMF) after each addition;
[0055] (3) After that, at ...
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