Array arrangement and transfer method and transfer device of Micro-LED substrate and display device

Abstract

The invention discloses an array arrangement and transfer method of a Micro-LED substrate. The method comprises the following steps of: according to the diameter of a Micro-LED, determining the ultrasonic wave length of a two-dimensional ultrasonic standing wave field by utilizing lambda/4 < D <= lambda/2; adjusting the positions of four transducers according to the ultrasonic wave wavelength and the size of a substrate, and forming an orthogonal two-dimensional ultrasonic standing wave field above the substrate; determining the node number of sound pressure nodes according to the size and the ultrasonic wave wavelength; and controlling a discharging device to place a preset number of Micro-LEDs according to the number of the nodes, so that the Micro-LEDs are diffused under the action of acoustic radiation force, and redundant Micro-LEDs fall off from the substrate. Therefore, the Micro-LEDs are diffused and sorted under the action of the acoustic radiation force of the two-dimensional ultrasonic standing wave field, so that each Micro-LED occupies one acoustic pressure node, array arrangement and huge amount transfer are realized, the operation is simple, the transfer efficiency is improved, and the cost is reduced. The invention further provides a transfer device and a Micro-LED display device which both have the above beneficial effects.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and in particular to a Micro-LED substrate (hereinafter referred to as Micro-LED) array arrangement transfer method, a Micro-LED substrate transfer device, and a Micro-LED display device. Background technique [0002] Micro-LED is a display technology that miniaturizes and matrixes the LED structure, and individually drives and addresses each pixel. Various indicators such as brightness, life, contrast, response time, energy consumption, viewing angle and resolution of micro light-emitting diodes are superior to LCD and OLED technologies, and are regarded as a new generation of display technology that can surpass OLED and traditional LEDs, but , due to the extremely high efficiency in the packaging process, the 99.9999% yield rate and the need for transfer accuracy within plus or minus 0.5μm; while the size of Micro-LED components is basically less than 50μm and the number is ten...

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Problems solved by technology

However, it only transfers LEDs with asymmetrical top and bottom edges, and pre-designed molds must be used, and the key to this method is the loading film with densely arranged loading slots. In terms of its fine and accurate processing, the processing cost of the mold is also low. Not too low; or use a large number of transfer head matrix adsorption transfer, altho

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