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Method of singulating semiconductor die and method of fabricating semiconductor package

A technology for semiconductors and packages, applied in the field of manufacturing semiconductor packages, can solve the problems of reducing the thickness and difficulty of handling semiconductor devices, etc.

Pending Publication Date: 2019-09-17
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The reduction in thickness of semiconductor devices used in electronic products may cause difficulties in handling semiconductor devices in various processes

Method used

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  • Method of singulating semiconductor die and method of fabricating semiconductor package
  • Method of singulating semiconductor die and method of fabricating semiconductor package
  • Method of singulating semiconductor die and method of fabricating semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0041] Light source: LD excitation Q-switched Nd:YVO4 laser

[0042] Wavelength: 1064nm pulsed laser

[0043] Pulse output: 10 microjoules

[0044] Convergence point diameter: 1 micron

[0045] Repetition frequency: 100kHz

[0046] Moving speed: 100mm / s.

example 2

[0048] Light source: LD excited Q-switched Nd:YAG laser

[0049] Wavelength: 1064nm pulsed laser

[0050] Pulse output: 20 microjoules

[0051] Convergence point diameter: 1 micron

[0052] Repetition frequency: 100kHz

[0053] Moving speed: 100mm / s.

[0054] image 3 is a sectional view of a mesa where an adhesive film 20A and a base film 30A are sequentially added to the semiconductor substrate 10 on which the modified layer 10 m has been formed.

[0055] refer to image 3 , the adhesive film 20A is called a die attach film (DAF), and may be attached to the second surface 10 b of the semiconductor substrate 10 .

[0056] The base film 30A may be attached to the adhesive film 20A. The base film 30A may include polyolefin-series polymers such as polyethylene (PE), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and polypropylene (PP). In particular, the base film 30A may have elasticity such that the base film 30A may expand in a lateral direction (ie, a di...

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PUM

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Abstract

The invention discloses a method of singulating a semiconductor die and a method of fabricating semiconductor package. The method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2018-0028238 filed with the Korean Intellectual Property Office on March 9, 2018, the entire contents of which are incorporated herein by reference. technical field [0003] Exemplary embodiments according to the inventive concept relate to a method of singulating a semiconductor die and a method of manufacturing a semiconductor package, and more particularly, to singulation by which device reliability is increased and failure rate is reduced. A method of semiconductor die and a method of manufacturing a semiconductor package. Background technique [0004] The reduction in thickness of semiconductor devices used in electronic products may cause difficulties in handling the semiconductor devices in various processes. In particular, warping of semiconductor wafers or dies can cause many problems, and therefore, a technique is required to solve these pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/78
CPCH01L21/78H01L21/67288H01L21/67144H01L21/67132H01L21/6836H01L2221/68336H01L23/562H01L21/561H01L2224/16225H01L21/76H01L21/52H01L23/48H01L21/02362H01L21/268H01L21/02348
Inventor 丁炳国金昞豪文渊曹安正哲赵成日千大相韩万熙
Owner SAMSUNG ELECTRONICS CO LTD