Anti-warping BGA (Ball Grid Array) chip packaging process and packaging structure thereof
A chip packaging structure and chip packaging technology, which is applied to the assembly of printed circuits with electrical components, printed circuits connected with non-printed electrical components, semiconductor devices, etc., can solve the problems that hinder the rework of BGA packaging, and achieve easy rework and difficult Electric short circuit, increase the effect of connection strength
Active Publication Date: 2022-08-02
太极半导体(苏州)有限公司
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Underfill and corner bonding are additional costs for BGA packages and also prevent BGA packages from being reworked if they do not meet product specifications
Method used
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[0031] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is intended to be illustrative only and in no way limit the disclosure, its application or use in any way. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that unless specifically stated otherwise, the relative arrangements of components and steps, compositions of materials and numerical values set forth in these examples are to be construed as illustrative only and not as limiting.
[0032] As used in this disclosure, "first," "second," and similar words do not denote any order, quantity, or importance, but are merely used to distinguish ...
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The invention provides an anti-warping BGA (Ball Grid Array) chip packaging process and a packaging structure thereof, and the packaging structure comprises a printed circuit board which is electrically provided with a series of bonding pads; the invention discloses a two-dimensional BGA (ball grid array), which comprises a chip element and a two-dimensional BGA, the two-dimensional BGA comprises a plurality of solder balls extending from the lower side of the chip element, a certain distance is reserved between the solder balls, the solder balls are made of tin-bismuth-based solder, and the solder balls further comprise electric insulation epoxy resin; the two-dimensional BGA further includes a plurality of anti-warpage spacers extending from an underside of the chip element, the anti-warpage spacers being located in the pitch between the solder balls, the anti-warpage spacers including an electrically insulating epoxy resin and a reinforcing material, where individual pads on the printed circuit board are disposed in alignment with each solder ball. Compared with the prior art, electric short circuit is not prone to occurring, and warping of chip elements is reduced or eliminated.
Description
technical field [0001] The invention relates to the packaging field of BGA chips, in particular to a warping-proof BGA chip packaging process and a packaging structure thereof. Background technique [0002] In the 1990s, with the advancement of technology, the integration of chips continued to improve, the number of I / O pins increased sharply, the power consumption also increased, and the requirements for integrated circuit packaging became more stringent. In order to meet the needs of development, BGA packaging began to be used in production. BGA is the abbreviation of English Ball Grid Array Package, namely Ball Grid Array Package, a high-density surface mount packaging technology. At the bottom of the package, the pins are spherical and arranged in a lattice-like pattern, hence the name BGA, and this type of packaging technology is mostly used in motherboard control chipsets. The memory packaged with BGA technology can increase the memory capacity by two to three times ...
Claims
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IPC IPC(8): H01L21/60H05K1/18H05K3/34
CPCH01L24/10H01L21/60H05K1/181H05K3/341H01L2224/10125H01L2021/60022H01L2021/60067H01L2224/81191H01L2224/81139H01L2224/16225
Inventor 陈登兵王钊平张光明
Owner 太极半导体(苏州)有限公司