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Circuit board based on fault discontinuous meshes and preparation process of circuit board

A technology for circuit boards and substrates, applied in the field of circuit boards based on fault-discontinuous meshes and its preparation process, can solve problems such as difficult to ensure the effective formation of partition layers and generation of bubbles, and achieve the elimination of transmission loss, accelerated fading, The effect of improving integrity

Inactive Publication Date: 2019-09-17
惠州市盈帆实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the above-mentioned patent, as long as the decomposition liquid can reach the place, the partition layer can be effectively formed. It does not need to consider the problem of depth control like the back-drilling process. The process is simple, and it will not leave defects such as short columns to affect the quality of signal transmission. Improve the integrity of the signal, but the decomposition liquid may generate bubbles in the through hole, it is difficult to ensure the effective formation of the isolation layer, and the decomposition liquid does not act in the through hole for a long time, which will also have a certain impact on the fading of the anti-plating layer

Method used

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  • Circuit board based on fault discontinuous meshes and preparation process of circuit board
  • Circuit board based on fault discontinuous meshes and preparation process of circuit board
  • Circuit board based on fault discontinuous meshes and preparation process of circuit board

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Experimental program
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Effect test

Embodiment 1

[0046] see figure 2 , a circuit board based on a fault-discontinuous mesh, including a first substrate 1 and a second substrate 2, the second substrate 2 is located on the upper side of the first substrate 1, and the second substrate 2 is connected to the first substrate 1 There is a connection piece 3, and the end of the second substrate 2 away from the first substrate 1 is also connected to the connection piece 3, and the connection between the first substrate 1 and the second substrate 2 and the connection piece 3 is connected with a plating resist 4, please refer to image 3 , the first substrate 1, the second substrate 2 and the connecting sheet 3 are correspondingly drilled with a plurality of through holes 5, please refer to Figure 4 , and the through hole 5 is located at the position of the plating resist layer 4 to set up the isolation layer region 6 .

[0047] see figure 1 , a circuit board based on fault discontinuous mesh, its preparation process is:

[0048] ...

Embodiment 2

[0063] see figure 2 , a circuit board based on a fault-discontinuous mesh, including a first substrate 1 and a second substrate 2, the second substrate 2 is located on the upper side of the first substrate 1, and the second substrate 2 is connected to the first substrate 1 There is a connection piece 3, and the end of the second substrate 2 away from the first substrate 1 is also connected to the connection piece 3, and the connection between the first substrate 1 and the second substrate 2 and the connection piece 3 is connected with a plating resist 4, please refer to image 3 , the first substrate 1, the second substrate 2 and the connecting sheet 3 are correspondingly drilled with a plurality of through holes 5, please refer to Figure 4 , and the through hole 5 is located at the position of the plating resist layer 4 to set up the isolation layer region 6 .

[0064] see figure 1 , a circuit board based on fault discontinuous mesh, its preparation process is:

[0065] ...

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Abstract

The invention discloses a circuit board based on fault discontinuous meshes and a preparation process of the circuit board, and belongs to the field of circuit boards. The circuit board comprises a first substrate and a second substrate, wherein the second substrate is positioned on the upper side of the first substrate; a connecting sheet is connected between the second substrate and the first substrate; the end, away from the first substrate, of the second substrate is also connected with a connecting piece. Anti-plating layers are connected to the joints of the first substrate and the connecting pieces and the joints of the second substrate and the connecting pieces. A plurality of through holes are correspondingly formed in the first substrate, the second substrate and the connecting pieces. In the preparation process, bubbles generated by the decomposition liquid in the through holes are removed; and in the bubble removing process, the removal of the anti-plating layer is accelerated by reversely utilizing the force generated by the burst of the bubbles. In addition, the time of the decomposition liquid acting on the through holes is reasonably controlled, so that the maximum removal of the anti-plating layer in the through holes can be realized, the transmission loss caused by the anti-plating layer is eliminated to a great extent, and the signal integrity is further improved.

Description

technical field [0001] The invention relates to the field of circuit boards, more specifically, to a circuit board based on fault discontinuous meshes and a preparation process thereof. Background technique [0002] With the development of communication technology, communication electronic products have higher and higher requirements for signals. As the signal frequency increases, the influence of circuit board design and processing is more obvious, and the loss of signal transmission also increases. In the through-hole design, there are often redundant paths that are not effective for signal transmission, and these paths have a significant impact on signal loss. At present, the industry mainly uses back drilling to remove the copper skin on the invalid path in the through hole to reduce the transmission loss of the signal and improve the signal integrity. [0003] Although the back-drilling process has been developed relatively maturely, there are still many disadvantages....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/46
CPCH05K3/0088H05K3/423H05K3/429H05K3/4611
Inventor 李争军刘立冬李爱明
Owner 惠州市盈帆实业有限公司
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