Probe card probe-grinding machine

Abstract

The invention discloses a probe card probe-grinding machine, and relates to the technical field of probe card manufacturing. The probe-grinding machine comprises a probe-grinding mechanism, a clamping mechanism, a horizontal ruler and a vertical ruler, wherein the probe-grinding mechanism comprises a lower sliding seat and an upper supporting seat, a lifting mechanism is arranged between the lower sliding seat and the upper supporting seat, the clamping mechanism comprises a fixed clamping body and a movable clamping body, and an amplifying device is rotationally arranged on one side of an upper base. According to the probe card probe-grinding machine, the height of the upper supporting seat is adjusted by rotating a screw, so that the grinding device on the upper supporting seat is in contact with clamping pins on the probe card, the distance between the grinding device and the probe card can be intuitively obtained through the vertical ruler and a side indicating rod, and the length of the pin tip in the grinding process can be conveniently controlled; the clamping mechanism is used for clamping the probe card, a telescopic rod is adjusted to drive a gear and a rack to move, so that opening and closing movement of a pressing plate is realized, and the probe card is clamped or taken down; and the distance between the fixed clamping body and the movable clamping body can be adjusted by referring to the horizontal ruler, and the machine is suitable for being used for the probe cards with different sizes.

Description

technical field [0001] The invention belongs to the technical field of probe card manufacturing, in particular to a needle grinding machine for probe cards. Background technique [0002] In recent years, semiconductor manufacturing technology has advanced by leaps and bounds. At present, products are thin, light and compact. ICs are getting smaller and stronger, with more and more pins. In order to reduce the area occupied by chip packaging and improve IC performance, flip-chip The packaging method is widely used in graphics chips, chipsets, memories and CPUs. The unit price of the above-mentioned high-end packaging method is high. If the chip test can be carried out before packaging, if there are defective products in the wafer, they will be marked immediately, and these marked defective products will be discarded before the subsequent packaging process, which can save unnecessary costs. packaging cost. [0003] The probe card is to directly contact the probes on the prob...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, when grinding the needle tip of the probe, the length of the needle tip cannot be directly observed, and it needs to be disassembled and measured repeatedly, and because the length of the needle tip cannot be directly observed, it is difficult to control the length of the needle tip during the grinding process, and it is easy to grind the needle tip too much. Short, which makes the loss of the probe is large, the product qualification rate is low, and the production cost remains high

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