Preparation method of high-strength nano heat-insulation board and high-strength nano heat-insulation board
A nano-heat insulation and high-strength technology, which is applied in the field of preparation of high-strength nano-heat insulation boards and high-strength nano-heat insulation boards, can solve problems such as poor flexural strength, easy damage, and inconvenient construction, cutting and installation, and achieve good resistance Bending strength, unbreakable effect
Active Publication Date: 2019-09-20
江西晖能新材料有限公司
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Problems solved by technology
[0002] Most of the current nano-insulation materials are formed by dry pressing, with good compressive strength but extremely poor flexural strength, only 0.2MPa, which is not convenient for construction, cutting and installation, and is very easy to break
Method used
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Embodiment 1
[0015] Disperse and mix nano silicon dioxide, opacifying agent, high silica glass fiber and nano alumina in a high-speed mixer in proportion, and at the same time, spray water glass into the powder by spraying to obtain a mixture. Open the discharge valve at the bottom of the mixer and feed the mixture into the mold in the press. Apply the mixture in the mold at 100~400T / m 2 The pressure is maintained for 3 minutes, and pressed into a plate. The plate is dried in an environment of 200-300° C. for about 30 minutes to obtain a finished product.
[0016] In parts by weight, the ratio of nano silicon dioxide, sunscreen agent, high silica glass fiber and nano aluminum oxide is 50:15:2:2, and the water glass component is 5% of the weight of all solids.
[0017] In this embodiment, zirconium silicate is used as the opacifying agent. In other embodiments, the opacifying agent may also be one or a combination of two or more of zirconium silicate, zirconium oxide, silicon carbide, ti...
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Abstract
The invention discloses a preparation method of a high-strength nano heat-insulation board. The preparation method comprises the following steps: mixing nano silicon dioxide, a light-shielding agent, high-temperature-resistant fibers and a high-temperature assistant by stirring, and meanwhile, spraying a high-temperature adhesive into the powder to obtain a mixture; feeding the mixture into a die in a press, and pressing the mixture into a board at a pressure of 100-400 T / m<2>; and drying the board in an environment of 200-300 DEG C to obtain the product. The nano heat insulation board prepared by the preparation method of the high-strength nano heat-insulation board is prepared by adopting a wet process, and the high-temperature adhesive is a liquid, so that the product has very good bending strength, and the product is not damaged easily in a cutting process.
Description
technical field [0001] The invention relates to the technical field of heat insulation board preparation, in particular to a preparation method of a high-strength nano heat insulation board and the high-strength nano heat insulation board. Background technique [0002] Most of the current nano-insulation materials are formed by dry pressing, with good compressive strength but extremely poor flexural strength, only 0.2MPa, which is not convenient for construction, cutting and installation, and is very easy to be damaged. Contents of the invention [0003] The object of the present invention is to provide a method for preparing a high-strength nano-insulation board and a high-strength nano-insulation board, which can solve one or more of the above-mentioned problems in the prior art. [0004] According to one aspect of the present invention, there is provided a method for preparing a flexible high-strength nano-insulation board, comprising the steps of: stirring and mixing n...
Claims
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IPC IPC(8): C04B28/24C04B28/26C04B28/00C04B26/04
CPCC04B28/24C04B28/26C04B28/005C04B26/04C04B2201/50C04B2111/00008C04B14/046C04B14/42C04B14/303C04B20/008C04B14/306C04B14/4631C04B14/324C04B14/4656
Inventor 袁江涛王海成
Owner 江西晖能新材料有限公司