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A method for obtaining offset slivers load during cleavage process of semiconductor materials

An acquisition method, semiconductor technology, applied in the direction of semiconductor/solid-state device testing/measurement, analytical materials, instruments, etc., can solve the problems of low production efficiency, difficult real-time measurement of critical load, etc., and achieve the effect of improving the quality of use and life

Active Publication Date: 2020-12-25
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, under the existing conditions, it is difficult to measure the critical load required for dissociation of wafers with different thicknesses in real time, and the production efficiency is low

Method used

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  • A method for obtaining offset slivers load during cleavage process of semiconductor materials
  • A method for obtaining offset slivers load during cleavage process of semiconductor materials
  • A method for obtaining offset slivers load during cleavage process of semiconductor materials

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Embodiment Construction

[0027] In order to make the technical means, creative features, goals and effects of the present invention easy to understand, the following embodiments will specifically illustrate the method for obtaining offset slivers loads during the cleavage process of semiconductor materials of the present invention in conjunction with the accompanying drawings.

[0028] figure 1 It is a cross-sectional view of the coordinate points and force-bearing points on the wafer in the embodiment of the present invention.

[0029] Step 1: If figure 1 As shown, use a blade to scratch on the wafer to generate scratches, measure the length L of the scratch, the thickness H of the wafer, and the depth a of the scribing, and establish a two-dimensional coordinate system with the center point O at the bottom of the scratch as the origin, and get o 1 and O 2 , O 1 is any point on the wafer cross-section where the point O of the wafer is located, and O 2 Point is located directly above point O and ...

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Abstract

The invention relates to a method for acquiring the offset splitting load in the cleavage process of a semiconductor material, which comprises the steps of scratching on a wafer with a blade to generate a scratch, measuring the scratch length L, the wafer thickness H and the scribing depth a according to the scratch on the wafer, establishing a two-dimensional coordinate system by taking the center point O at the bottom of the scratch as an origin so as to obtain O1 and O2, and thus judging the minimum offset splitting load required for wafer fracture according to a cleavage fracture stress formula.

Description

technical field [0001] The invention relates to the technical field of semiconductor optoelectronic devices, in particular to a method for obtaining offset slivers loads during the cleavage process of semiconductor materials. Background technique [0002] The semiconductor industry has developed rapidly along with the last round of computer and Internet technology revolution. Among them, the chip, as the core component of the computer, accounts for the vast majority of the cost of the entire computer, so in the following decades, the chip has shown a vigorous development trend. [0003] In recent years, China's chip industry has begun to develop rapidly, but the domestic integrated circuit chip manufacturing technology level is far from the world's advanced level, and it is still in its infancy. The chip manufacturing process needs to go through a series of specific processing technologies, among which the splitting process is one of the most important steps in the packagin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01N3/06
CPCG01N3/06G01N2203/0066G01N2203/0676G01N2203/0682H01L22/12
Inventor 姜晨高睿董康佳郎小虎任绍彬
Owner UNIV OF SHANGHAI FOR SCI & TECH