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Electronic equipment stamping hardware piece and production process thereof

A technology for electronic equipment and production process, applied in the field of electronic equipment stamping hardware and its production process, can solve the problems of insufficient strength and low heat dissipation efficiency of heat sinks, and achieve the effects of increasing strength, good heat dissipation, and ensuring heat dissipation area

Pending Publication Date: 2019-09-27
吴义友
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides stamping hardware for electronic equipment and its production process, and solves the problems of low heat dissipation efficiency and insufficient strength of the existing heat sink through technical transformation of the existing hardware heat sink

Method used

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  • Electronic equipment stamping hardware piece and production process thereof
  • Electronic equipment stamping hardware piece and production process thereof
  • Electronic equipment stamping hardware piece and production process thereof

Examples

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Embodiment Construction

[0030] The specific content of the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0031] Such as Figure 1-2 As shown, this embodiment provides a stamping hardware for electronic equipment, the hardware is a sheet-like structure, one side of the sheet 1 is a smooth plane, and the other side of the sheet 1 is evenly distributed with outwardly protruding bumps 2 . The bumps include but not limited to bumps, bumps or ribs.

[0032] Further, the cut-off surface of each bump 2 includes but not limited to arc, circle and elongated shape, and the design of the bumps on the back increases the heat dissipation area, and at the same time strengthens the load-bearing strength and anti-pressure of the sheet ability.

[0033] Further, the thickness of the sheet 1 is 0.04mm-1mm, and the sheet material is a metal sheet or a non-metal sheet for heat transfer. The thickness of the heat sink is greatly reduced compared wi...

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PUM

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Abstract

The invention provides an electronic equipment stamping hardware piece which is of a sheet-like structure. One surface of the sheet is a smooth plane, and the other surface of the sheet is uniformly provided with outward protruding convex points. A production process of the electronic equipment stamping hardware piece comprises the steps of guide hole punching, strip positioning, convex point forming, convex point shaping, trimming, leveling, secondary convex point shaping and blanking. Radiating fins are formed in a stamping mode, so that the thickness of the radiating fins reaches 0.07mm-0.09mm, meanwhile, convex points are stamped and formed on the back surfaces of the radiating fins, the uniformly-distributed convex points play a role of supporting stress, and the strength of the radiating fins is increased. Meanwhile, due to the design of the radiating convex points, circulation of air is guaranteed, the radiating area is guaranteed, and the radiating effect is better achieved.

Description

technical field [0001] The invention relates to the technical field of stamping parts, in particular to a stamping hardware part of electronic equipment and a production process thereof. Background technique [0002] The heat sink is a device for cooling the heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze into plates, sheets, and multi-sheets. For example, the CPU central processing unit in a computer needs to use a large Heat sinks, power tubes in TVs, line tubes, and power amplifier tubes in power amplifiers all use heat sinks. [0003] At present, the commonly used heat sink materials are copper and aluminum alloy, both of which have their own advantages and disadvantages. Copper has good thermal conductivity, but it is more expensive, difficult to process, and easy to oxidize. However, pure aluminum is too soft to be used directly. All aluminum alloys are used. Ultra-thin aluminum alloys are easily damaged...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D53/04B21D37/08H05K7/20
CPCB21D53/04B21D37/08H05K7/20
Inventor 吴义友
Owner 吴义友
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