Silicon slice tensile positionable cutting device

Abstract

The invention relates to the technical field of silicon slice machining, and discloses a silicon slice tensile positionable cutting device. The device comprises a base; a fixed plate is fixedly mounted on the right side wall of an inner cavity of the base; and a servo motor is fixedly mounted on the left side of the fixed plate. In the silicon slice tensile positionable cutting device, through startup of the servo motor, a thread rod is rotated, and a movable sleeve rod moves left and right when being suffered from thread thrust during rotating of the thread rod; when silicon slices need to becut, the silicon slices are firstly placed above the base, and then, the servo motor is controlled to rotate, so that a push plate moves to the left side, and the silicon slices are pushed to the left side to penetrate through a cutting head; a hydraulic pump is started; a compression spring and a fixed rod are arranged between a movable plate and a pressing plate; when the silicon slices are pressed by the pressing plate, a certain buffer effect on pressure suffered by the pressed silicon slices is achieved, so that the silicon slices are difficultly damaged; and the pressure suffered by thesilicon slices is more uniform, so that the silicon slices can be fixed, and equipment achieves a stable positioning effect.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a tensile and positionable cutting device for silicon wafers. Background technique [0002] Polycrystalline silicon is a form of elemental silicon. When molten elemental silicon solidifies under supercooled conditions, silicon atoms are arranged in the form of diamond lattices to form many crystal nuclei. If these nuclei grow into crystal grains with different crystal plane orientations, then These grains combine to crystallize into polysilicon. [0003] The silicon wafer cutting devices commonly used in the market generally have the disadvantage of unstable positioning. The silicon wafer is prone to slight deviation during the cutting process, resulting in insufficient cutting of the silicon wafer, which affects the quality of the finished silicon wafer and is not easy to connect. Down to the installation problem. Contents of the invention [0004] (1) Solve...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a tensile and positionable cutting device for silicon wafers, which has the advantages of stable positioning, etc., and solves the disadvantages of generally unstable positioning of silicon wafer cutting devices commonly used in the market. Minor deviations are prone to occur during the cutting process, resulting in insufficient cutting of silicon wafers, which affects the quality of finished silicon wafers and is not convenient for subsequent installation.

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