Substrate structure and its manufacturing method and conductive bump

Abstract

The invention relates to a substrate structure, a manufacturing method thereof and a conductive bump. A manufacturing method of a substrate structure, forming a metal layer and a plurality of conductive pillars on a substrate body, and then removing the metal layer not covered by the conductive pillars by etching with an electrolytic solution, so that no residue remains between the two conductive pillars. metal material, without increasing the etching time to remove the residual metal material, avoiding the problem of excessive etching at the bottom of the conductive pillar.

Description

technical field [0001] The invention relates to a substrate structure, in particular to a substrate structure with conductive bumps and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, semiconductor chip packaging forms include wire bonding (Wire Bonding) packaging or flip chip (Flip Chip) packaging. Through conductive bumps instead of ordinary bonding wires, the conductive bumps provide electrical input / output (I / O) and mechanical connections between the semiconductor chip and the packaging substrate. This packaging structure can greatly reduce the volume , At the same time, it also subtracts the design of the existing bonding wires, which can reduce the impedance and improve the electrical properties, so as to avoid the degradation of the signal during the transmission process, so it has becom...

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Problems solved by technology

[0007] However, in the existing manufacturing method of the conductive bump 1a, during the process of chemically etching the copper layer 12, the copper material 12a (such as Figure 1C shown), so when the chemical etching is continued to remove the copper material 12a, it is easy to cause over etching of the copper layer 12 and the titanium layer 11 at the bottom of the copper pillar 14, causing the copper pillar 14' to fall off (peeling) ,like Figure 1D shown

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