A micro-nano dual-mode detection processing module

A micro-nano, flexible hinge technology, applied in the direction of nanotechnology, microstructure technology, microstructure devices, etc., can solve the problems of processing system motion accuracy, workpiece installation, adjustment accuracy, tool cutting accuracy and difficult processing requirements, etc., to achieve low cost and improve lateral The effect of rigidity and simple structure

Active Publication Date: 2022-02-08
HARBIN INST OF TECH
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the motion accuracy of the existing processing system, the adjustment accuracy of the workpiece installation, and the cutting accuracy of the tool are difficult to meet the above processing requirements.

Method used

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  • A micro-nano dual-mode detection processing module
  • A micro-nano dual-mode detection processing module
  • A micro-nano dual-mode detection processing module

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Embodiment Construction

[0032] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention. within the scope of protection.

[0033] The invention discloses a micro-nano dual-mode detection and processing module, such as figure 1 As shown, the module includes a Z-direction piezoelectric displacement table 1, a bracket 2, a capacitive displacement sensor 3, a capacitor fixing seat 4, an adjusting seat 5, a locking support 6, an upper fixing ring 7, a PZT vibrator 8, Lower fixing ring 9, test screw 10, flexible hinge 11, stop ring 12, fixing nut 13 and probe 14, wherein:

[0034] The capacitive displacement sensor 3 passes through the second set screw 17 ( Figure 11 ) is fixe...

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Abstract

The invention discloses a micro-nano dual-mode detection and processing module. The module includes a Z-direction piezoelectric displacement platform, a bracket, a capacitive displacement sensor, a capacitor fixing seat, an adjusting seat, a locking support, an upper fixing ring, a PZT excitation Vibrator, lower fixing ring, test screw, flexible hinge, retaining ring, fixing nut and probe, wherein: the capacitive displacement sensor is fixed on the capacitor fixing seat; the capacitor fixing seat is fixed on the adjustment seat; the upper The fixed ring, PZT vibrator, lower fixed ring, test screw, flexible hinge, stop ring, fixed nut and probe are fixed below the adjustment seat in sequence; the probe is fixed on the flexible hinge through the fixed nut and test screw; The adjusting seat is fixed on the locking support; the locking support is fixed on the support; the support is fixed on the Z-direction piezoelectric displacement stage. This module has the functions of online detection and servo processing. Compared with commercial AFM, it has a larger processing size and material application range.

Description

technical field [0001] The invention relates to a micro-nano dual-mode detection and processing module. Background technique [0002] The development and application of MEMS and NEMS has promoted technological innovation in the field of micro-nano. At present, the mainstream micro-nano processing technology includes optical and electron beam exposure, focused ion beam processing, LIGA, etc., but due to the single processing material, complex and expensive equipment, the technology is difficult Breakthroughs have limited the development of the domestic micro-nano industry. Although the traditional "macro" mechanical manufacturing technology cannot meet the needs of micro-nano processing, the breakthrough of piezoelectric ceramics and sensor technology has made "micro" mechanical manufacturing possible, and the processing materials of "micro" mechanical manufacturing are not limited, and the processing structure is also Not limited to two-dimensional and quasi-three-dimension...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00B82Y40/00
CPCB81C99/0005B82Y40/00
Inventor 闫永达史文博耿延泉胡振江王桐常顺宇
Owner HARBIN INST OF TECH
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