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Thermal evaluation system and thermal evaluation method

An evaluation method and thermal evaluation technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., to solve problems such as expensive hardware, high overhead, and inability to produce satisfactory results

Active Publication Date: 2022-04-05
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional temperature monitoring and control techniques may require high overhead and expensive hardware, yet still fail to produce satisfactory results
Therefore, conventional temperature monitoring and control techniques are not entirely satisfactory

Method used

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  • Thermal evaluation system and thermal evaluation method
  • Thermal evaluation system and thermal evaluation method
  • Thermal evaluation system and thermal evaluation method

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Embodiment Construction

[0043] The following disclosure provides many different embodiments, or examples, for implementing different components of an embodiment of the disclosure. Specific examples of components and configurations are described below to simplify the description of the embodiments of the disclosure. Of course, these specific examples are only for illustration and not for configuration to limit the embodiments of the present disclosure. For example, it will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or it may have one or more intervening elements. elements between the aforementioned two.

[0044] In addition, the same reference signs and / or labels may be reused in different examples of the following disclosure. These repetitions are for the purposes of simplicity and clarity, and are not configured to dictate the relationship between the different embodiments and / ...

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Abstract

In an embodiment, a method of thermal evaluation includes: generating a phase change material on a platform configured to process a semiconductor workpiece, setting the phase change material to an amorphous state, performing the semiconductor workpiece process in a semiconductor processing chamber, and Phase change materials measure impedance across two points.

Description

technical field [0001] Embodiments of the present disclosure relate to a thermal evaluation system and a thermal evaluation method, in particular to a thermal evaluation method based on phase change materials. Background technique [0002] In semiconductor workpiece fabrication (process), a variety of applications involve thermal processing of wafers or semiconductor workpieces, and other materials involving rapid heating and cooling of semiconductor workpieces. Examples of such processing include rapid thermal processing (RTP), physical vapor deposition (PVD), dynamic surface annealing (DSA), and other similar processes, and are used in several semiconductor manufacturing processes. These processes are usually heat-based and typically involve high processing temperatures, for example in the range of 200°C to 1600°C, which can lead to serious thermal budget issues and can be detrimental to the device. performance is negatively affected. [0003] In general, processing cham...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67248H01L22/14H10N70/882H10N70/231H10N70/041H10N70/023H10N70/8828
Inventor 陈建茂许宏任
Owner TAIWAN SEMICON MFG CO LTD