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A polymer film thermocompression forming device and film forming process

A technology of polymer film and hot pressing, applied in the field of molds, can solve the problems of low hot pressing accuracy and low hot pressing efficiency, and achieve the effects of improving the thermoforming efficiency, simple structure and improving the thermoforming effect.

Active Publication Date: 2021-02-12
肇庆市宏华电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the deficiencies of the existing technology and solve the problems of low hot-pressing precision and low hot-pressing efficiency in the hot-pressing forming of polymer films, the present invention proposes a polymer film hot-pressing forming device and a film forming process

Method used

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  • A polymer film thermocompression forming device and film forming process
  • A polymer film thermocompression forming device and film forming process
  • A polymer film thermocompression forming device and film forming process

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Embodiment approach

[0028] As a specific embodiment of the present invention, the shape of the No. 1 channel 31 is spiral, and the contact area between the hot gas and the upper die 3 is increased through the No. 1 channel 31 of the spiral shape; the present invention adopts this design , so that the hot gas input into the No. 1 pipeline fully contacts with the upper die 3, and makes the upper die 3 fully heated, which improves the thermoforming effect of the polymer film.

[0029] As a specific embodiment of the present invention, the upper die 3 is composed of a metal seat 32, a transition layer 33 and a rubber release layer 34; one end of the transition layer 33 is connected to the rubber release layer 34, and the other end is connected to the metal seat 32 connection; through the mutual cooperation between the metal seat 32, the transition layer 33 and the rubber anti-sticking layer 34, the rupture of the polymer film is avoided; through this design, the transition layer 33 can bear a part of ...

specific Embodiment approach

[0031] As a specific embodiment of the present invention, a No. 1 chamber 51 is provided on the lower bottom plate 5, and the No. 1 chamber 51 communicates with the housing 61 through a hose, and the communication point is located above the T-shaped movable plate 62; The No. 1 hole 41 is provided with an ejection unit 7; the ejection unit 7 includes a No. 1 plate 71, a T-shaped ejector rod 72 and a locking block 73; one end of the No. 1 plate 71 is connected to the T-shaped top The outlet rod 72 is connected, and the T-shaped part of the T-shaped ejector rod 72 is provided with an air outlet, and the other end of the No. 1 plate 71 is fixedly connected to the groove of the upper bottom plate through a spring, and communicates with the No. 1 chamber 51 through the channel; The locking block 73 is fixedly connected to the side wall of the No. 1 hole 41, and the locking block 73 and the No. 1 plate 71 are engaged with each other; Cooperate with each other to realize the ejection ...

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Abstract

The invention belongs to the technical field of moulds, in particular to a polymer film hot press forming device and a film forming process; including an upper top plate, a No. 1 cylinder, an upper die, a pillar, a lower die seat, a lower bottom plate, a heating unit and a controller ; The heating unit is located on both sides of the lower die base, and the heating unit includes a housing, a T-shaped movable plate, a pressing plate, a No. 1 hose and a No. 2 hose; in one aspect of the present invention, while the upper die is moving, the hot air is The upper die is heated to avoid the temperature of the upper die being too low due to the time interval during molding when the existing whole is heated on the upper die, which affects the thermoforming quality of the polymer film, thereby improving the thermoforming effect of the polymer film ; On the other hand, realize one source with multiple functions, use the force of the upper die and the lower die base to cooperate with the polymer film in forming, realize the input of the hot air in the heating unit into the upper die, and heat the upper die, thereby improving the Polymer film thermoforming efficiency.

Description

technical field [0001] The invention belongs to the technical field of moulds, and in particular relates to a polymer film thermocompression forming device and a film forming process. Background technique [0002] Thermoforming of polymer films is widely used in the electronics industry, especially the core components of micro-speakers, receivers, earphones, etc. - vibration plates, all need thermoforming. [0003] Existing thermocompression molding equipment, when heating the die head, moves to the vicinity of the die head through a heating block with a fixed temperature, and heats the die head through heat conduction. The temperature of the heating block is much higher than Tg (glass transition temperature: the temperature at which a high polymer changes from a high elastic state to a glass state, which means that the amorphous polymer, including the amorphous part of a crystalline polymer, changes from a glass state to a high elastic state or from a high elastic state. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/08B29C51/42B29C51/26
CPCB29C51/082B29C51/26B29C51/421B29C51/428
Inventor 李艳梅王利萍陈小童李境多许伟喜陈英俊
Owner 肇庆市宏华电子科技有限公司
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