A multi-chip integrated circuit package

Abstract

The invention relates to the field of integrated circuit packaging, in particular to a multi-chip integrated circuit packaging, including a basket frame, an access panel, a driving structure, a packaging structure, wiring holes and a sealing structure; During the process, the packaging structure vibrates, squeezes and deforms, and the packaging structure consumes the energy of the vibration of the basket, which reduces the vibration energy of the chip on the sealing structure inside the packaging structure, thereby effectively preventing the chip from being damaged. At the same time, the packaging structure promotes packaging through the vibration energy. The air circulation inside the structure can quickly cool down the packaging structure. The sealing structure is set inside the packaging structure to reduce the impact of vibration on the chip on the sealing structure. The use of the sealing structure makes the installation of the packaging structure more convenient and fast. When the structure is extruded and deformed, the sealing performance between the sealing structure and the packaging structure is improved, and the sealing structure further promotes the heat dissipation performance of the packaging structure, thereby improving the dustproof performance of the chip.

Description

Technical field[0001]The present invention relates to the field of integrated circuit packaging, and specifically a multi-chip integrated circuit package.Background technique[0002]Integrated circuit or semiconductor chip package In protective insulation packaging materials, encapsulation materials should provide good balance between physical properties, chemical properties, and cost, for conventional semiconductor chips, manufacturing package by molding process required for hydraulic press.[0003]However, the integrated circuit is packaged in the automatic count of basketball, and the traditional counter requires artificial record data. When watching the school basketball game at the scene, the goal is used to observe the goal in the manner, and then according to the case of the visual measure. Introducing data, counting the numbers of the basketball, when the basketball is directly used, the basket is iron material, and the long-term use of the outdoor temperature is fast, and it is...

AI Technical Summary

Problems solved by technology

[0003] However, integrated circuit packaging is rarely used in the automatic counting of basketballs. Traditional counters need to manually record data. Enter data in the computer to count the number of goals scored by both sides of the basketball. When it is directly used to count on the basket, the basket is made of iron material. It is used outdoors for a long time and the temperature conduction speed is fast, which is easy to affect the performance of the internal chip. During the shooting process, the vibration frequency of the basket is high, which is likely to affect the stability of the internal chip, and the long-term use of the chip outdoors requires the sealing of the package, which may easily cause damage to the package connection during the vibration process

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