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A manufacturing device for a plastic-encapsulated optocoupler

A technology for optocoupler and manufacturing device, applied in semiconductor/solid-state device manufacturing, electric solid-state device, circuit, etc.

Active Publication Date: 2021-04-09
深圳市得润光学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a manufacturing device for a plastic-encapsulated photocoupler, which overcomes problems such as low work efficiency and improves work efficiency

Method used

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  • A manufacturing device for a plastic-encapsulated optocoupler
  • A manufacturing device for a plastic-encapsulated optocoupler
  • A manufacturing device for a plastic-encapsulated optocoupler

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Embodiment Construction

[0016] Combine below Figure 1-4 The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are defined as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0017] combined with Figure 1-4 The manufacturing device of a plastic-encapsulated photocoupler mainly includes a base 1, the upper end of the base 1 is fixed with a support plate 2, and the upper end of the base 1 is also fixed with three supports whose rear ends pass through the support plate 2. Block 3, the upper ends of the support blocks 3 on both sides are provided with a conveyor belt 4 and a chip 14, and the upper end of the support block 3 in the middle is provided with two gold islands 13 of metal lead frame tube legs, and the support plate 2 is provided with Two air pressure mechanisms 78, the front side of the support plate 2 is provided with a transmission mechanism 77, ...

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Abstract

The invention discloses a manufacturing device of a plastic-encapsulated photoelectric coupler, which comprises a base, a support plate is fixed on the upper end surface of the base, and three support blocks whose rear ends pass through the support plate are fixed on the upper end surface of the base. The upper end of the support block is provided with a conveyor belt and a chip, and the upper end of the support block in the middle is provided with two gold islands for metal lead frame tube legs. Transmission mechanism, the left and right sides of the transmission mechanism are provided with two moving mechanisms that can transport the chips on the conveyor belt to the upper side of the gold island, and the left and right sides of the transmission mechanism are also equipped with two moving mechanisms The coating mechanism for applying conductive glue on the lower end surface of the chip can fully automatically stick the chip to the gold island of the metal lead frame tube leg when forming a plastic-encapsulated photocoupler at one time, without manual sticking, improving Improve work efficiency, save labor, and improve the degree of automation.

Description

technical field [0001] The invention relates to the field of optoelectronics, in particular to a manufacturing device for a plastic-encapsulated optocoupler. Background technique [0002] At this stage, when forming a plastic-encapsulated optocoupler at one time, it is necessary to bond the light-emitting chip and the light-receiving chip to the gold island of the metal lead frame tube leg in advance to facilitate one-time molding; [0003] At this stage, when molding a plastic-encapsulated optocoupler, most of them need to manually debond the chip. In the case of heavy workload, the efficiency is reduced, and when molding a plastic-encapsulated optocoupler, most of the couplers are placed in the same mold. At the same time, one-time molding and manual bonding of chips need to be done many times, which is not efficient. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a manufacturing device for a plastic-encapsul...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603H01L21/683H01L25/16
CPCH01L21/6838H01L24/83H01L25/167H01L2224/83201
Inventor 李凤鸣
Owner 深圳市得润光学有限公司
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