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Process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof

A technology of hand-tearing position and punching knife, which is applied in the direction of metal processing, etc., can solve the problems of high operation skills of die-cutting machine personnel, affecting the product qualification rate, and unstable punching pressure, so as to save personnel expenses and costs , Improve customer satisfaction and reduce working hours

Pending Publication Date: 2019-10-25
深圳市锦上嘉科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the pressure stability of different die-cutting machines is generally different during operation, when the die-cutting machine is punching the main material, it is easy to punch too deep due to the unstable punching pressure, so that the hand-tearing position of the base film under the main material There are indentations or delamination and breakage at the hand-torn position, which will affect the pass rate of the product
On the other hand, when using the existing die-cutting machine to die-cut accessories with hand-tearing positions, the existing die-cutting process requires high stability of the die-cutting machine and operation skills of the machine personnel, resulting in high production costs and The problem of low production efficiency

Method used

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  • Process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof
  • Process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof
  • Process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Process for preparing hand-teared products without punching marks, such as Figure 1-4 As shown, it includes the following steps:

[0037] A. Use the first bonding mechanism 20 to bond the first protective film 10 and the side of the release paper 11 away from the release surface, and the release paper 11 is sequentially provided with a positioning area 111 in the width direction of the release surface. Hand-tearing position area 112 and bearing area (not marked in the figure);

[0038] B. Use the second bonding mechanism 30 to sequentially bond the second protective film 12 and the main material 13 to the bearing area of ​​the release paper 11, and the waste area 131 is located in the main material area 132 and the hand-tear area Between 112;

[0039] C. Use the dotted line knife 47 of the die-cutting mechanism 40 to punch the release paper 11 and the first protective film 10 along the boundary line between the hand-tearing area 112 and the bearing area, and use the ...

Embodiment 2

[0045] Die-cutting equipment for preparing hand-teared products without punching marks, such as Figure 5 As shown, it includes a first bonding mechanism 20 for bonding the first protective film 10 and a release film arranged in sequence, and a first bonding mechanism 20 for bonding the second protective film 12 and the main material 13 sequentially until the first bonding The second bonding mechanism 30 on the release surface of the release film processed by the mechanism 20, the die-cutting mechanism 40 for punching the composite material tape after the processing of the second bonding mechanism 30, and the die-cutting mechanism 40 for The die-cutting mechanism 40 is used to fold the composite material tape after being folded, the waste material collection mechanism 60 for collecting waste materials, and the positioning punching tool for punching the composite material tape after being processed by the waste material collection mechanism 60 Institution70.

[0046] Among the...

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PUM

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Abstract

The invention relates to the technical field of electronic ingredient preparation, in particular to a process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof. The die cutting equipment comprises a first bonding mechanism for bonding first protective films and release films, a second bonding mechanism for bonding second protective films and main materials on release surfaces of the release films treated by the first bonding mechanism in sequence, a die cutting mechanism for punching composite strip treated by the second bonding mechanism, an opposite bonding platform for folding the composite strips punched by the die cutting mechanism, a waste collecting mechanism for collecting wastes and a positioned punching mechanism forpunching the composite strips treated by the waste collecting mechanism, which are arranged in sequence; and the prepared products have no cutter marks in the hand tearing positions, so that the product yield and the production efficiency are improved. The process can reduce the requirements on the stability of the die cutting equipment and on the skill of stand operators.

Description

technical field [0001] The invention relates to the technical field of preparation of electronic auxiliary materials, in particular to a process for preparing hand-teared products without punching marks and die-cutting equipment thereof. Background technique [0002] At present, the auxiliary materials of electronic products such as mobile phones, speakers, and computers are generally prepared by first adhering the main material to the base film such as the release film, and then punching the main material and the base film by a die-cutting machine according to the product needs. The corresponding shape, and in order to facilitate the customer to remove the auxiliary material product from the base film, it is necessary to punch out a hand-tear position on the base film. However, because the pressure stability of different die-cutting machines is generally different during operation, when the die-cutting machine is punching the main material, it is easy to punch too deep due ...

Claims

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Application Information

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IPC IPC(8): B26F1/38B26F1/44B26D7/27B26D7/00
CPCB26F1/38B26F1/44B26D7/27B26D7/00Y02P70/10
Inventor 黎胜华甘垄西
Owner 深圳市锦上嘉科技有限公司