Process for preparing products without punching cutter marks in hand tearing positions and die cutting equipment thereof
A technology of hand-tearing position and punching knife, which is applied in the direction of metal processing, etc., can solve the problems of high operation skills of die-cutting machine personnel, affecting the product qualification rate, and unstable punching pressure, so as to save personnel expenses and costs , Improve customer satisfaction and reduce working hours
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Embodiment 1
[0036] Process for preparing hand-teared products without punching marks, such as Figure 1-4 As shown, it includes the following steps:
[0037] A. Use the first bonding mechanism 20 to bond the first protective film 10 and the side of the release paper 11 away from the release surface, and the release paper 11 is sequentially provided with a positioning area 111 in the width direction of the release surface. Hand-tearing position area 112 and bearing area (not marked in the figure);
[0038] B. Use the second bonding mechanism 30 to sequentially bond the second protective film 12 and the main material 13 to the bearing area of the release paper 11, and the waste area 131 is located in the main material area 132 and the hand-tear area Between 112;
[0039] C. Use the dotted line knife 47 of the die-cutting mechanism 40 to punch the release paper 11 and the first protective film 10 along the boundary line between the hand-tearing area 112 and the bearing area, and use the ...
Embodiment 2
[0045] Die-cutting equipment for preparing hand-teared products without punching marks, such as Figure 5 As shown, it includes a first bonding mechanism 20 for bonding the first protective film 10 and a release film arranged in sequence, and a first bonding mechanism 20 for bonding the second protective film 12 and the main material 13 sequentially until the first bonding The second bonding mechanism 30 on the release surface of the release film processed by the mechanism 20, the die-cutting mechanism 40 for punching the composite material tape after the processing of the second bonding mechanism 30, and the die-cutting mechanism 40 for The die-cutting mechanism 40 is used to fold the composite material tape after being folded, the waste material collection mechanism 60 for collecting waste materials, and the positioning punching tool for punching the composite material tape after being processed by the waste material collection mechanism 60 Institution70.
[0046] Among the...
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