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Testing device and testing method of integrated circuit printed board

A technology of integrated circuits and test devices, applied in the field of communication, can solve problems such as the contradiction between coverage rate and test cost

Active Publication Date: 2019-10-29
DATANG MOBILE COMM EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a test device and a test method for an integrated circuit printed board, which are used to solve the technical problem of the contradiction between coverage and test cost in the BSCAN test method in the prior art

Method used

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  • Testing device and testing method of integrated circuit printed board
  • Testing device and testing method of integrated circuit printed board
  • Testing device and testing method of integrated circuit printed board

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Embodiment Construction

[0041] The invention provides a test device and a test method for an integrated circuit printed board, which are used to solve the technical problem of the contradiction between coverage and test cost in the BSCAN test method in the prior art.

[0042] In order to solve the problems of the technologies described above, the general thinking of the present invention is as follows:

[0043] First, the devices contained in the entire IC printed board to be tested are divided into two parts. The first part of the devices is a plurality of devices connected in sequence in the IC printed board, and the second part of the devices is the components in the IC printed board. A plurality of sequentially connected devices other than the first part of devices, the function of which is different from that of the second part of devices, a first part of the first part of devices is used for at least two of the second part of devices The second device performs voltage conversion. Then, the fir...

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Abstract

The invention discloses a testing device and a testing method for an integrated circuit printed board. The testing device comprises: a first boundary scanning debugger which comprises a first port anda second port, the first port is connected with the input end of a first device in a first part of devices of the integrated circuit printed board, and the second port is connected with the output end of a last device in the first part of devices; a second boundary scanning debugger that comprises a third port and a fourth port, the third port is connected with the input end of a first device ina second part of devices of the integrated circuit printed board, and the fourth port is connected with the output end of a last device in the second part of devices; and a connecting line test unit that comprises a third boundary scanning debugger and a fourth boundary scanning debugger, the third boundary scanning debugger is connected with the N first ports of the first device, the fourth boundary scanning debugger is connected with the N second ports of the at least two devices, and the N first ports are connected with the N second ports.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a test device and a test method for an integrated circuit printed board. Background technique [0002] With the miniaturization of communication equipment, the integration density of communication boards is increasing. This communication board can be a baseband processing unit (Building Base band Unit, BBU) board, so that it is impossible to reserve test points on the board. Then test the quality of the communication board by means of a probe. [0003] In the prior art, a Boundary Scan (BSCAN) test is used to test the quality of the communication board. Specifically, if figure 1 As mentioned above, a unit for testing is integrated in each chip, that is, a boundary scan unit. When the chip is running normally, the boundary scan unit bypasses (Bypass) all input signals or output signals, and does not Signals have effects such as figure 2 The signal flow in 1 is shown in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R1/0416G01R31/2801G01R31/2803
Inventor 郑洋冯亮
Owner DATANG MOBILE COMM EQUIP CO LTD