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Device for coating protective material on surface of chip electronic component

A technology of electronic components and surface coating, which is applied in the direction of spraying devices, spray booths, etc., can solve the problems of small size, difficult manual operation, low efficiency of coating work, etc., and achieve the effect of improving work efficiency

Active Publication Date: 2019-11-05
南理工泰兴智能制造研究院有限公司
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings in the prior art, such as: due to the small size of the existing chip components, it is difficult to coat the surface, and because both sides of the electronic components need to be coated Therefore, the manual operation is difficult, and the electronic components need to be turned over during the coating operation, so the coating work efficiency is low

Method used

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  • Device for coating protective material on surface of chip electronic component
  • Device for coating protective material on surface of chip electronic component
  • Device for coating protective material on surface of chip electronic component

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0020] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0021] refer to Figure ...

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Abstract

The invention discloses a device for coating a protective material on the surface of a chip electronic component. The device comprises transmission rollers, wherein rotating shafts are fixedly connected to the center of the two transmission rollers, supporting columns are fixedly connected to the two ends of the rotating shafts, fixing plates are fixedly connected between every two supporting columns on the same side, and a stepping motor is fixedly connected to one side wall of one supporting column. According to the device, manual feeding is only needed, and an electric appliance element canbe automatically coated and dried under the driving of the stepping motor under the driving of the stepping motor, the electric appliance element can be automatically coated and dried under the action of a magnetic force, the two sides of the electric appliance element can be automatically coated with a protective material; after the coating is finished, the automatic discharging can be realized,so that the device is very simple and convenient to use; and due to the need of manual turning, the working efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of surface coating of electronic components, in particular to a device for coating protective materials on the surface of chip electronic components. Background technique [0002] Chip electronic components are widely used in notebook computers, TVs, DVDs, mobile communication terminals and other equipment. In order to make them have excellent solderability during the production process, the terminal electrodes of the components need to be electroplated. A variety of process reasons will cause the surface of the component to be plated with metal conductive points, so that the risk of short circuit cannot be completely avoided during the welding process of the component. In addition, the electrical performance of some components will be deteriorated due to the corrosion of the plating solution on the surface during electroplating, which will greatly reduce the yield rate. Therefore, it is necessary to Surface...

Claims

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Application Information

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IPC IPC(8): B05B13/02B05B16/20
CPCB05B13/0221B05B16/20
Inventor 夏鲲
Owner 南理工泰兴智能制造研究院有限公司
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