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Coil and manufacturing method thereof

A manufacturing method, coil technology, applied in the direction of coil manufacturing, coil, transformer/inductor coil/winding/connection, etc.

Pending Publication Date: 2019-11-05
ACEINNA TRANSDUCER SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, how to mass-produce high-precision coils with high efficiency and low cost has always been a difficulty

Method used

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  • Coil and manufacturing method thereof
  • Coil and manufacturing method thereof
  • Coil and manufacturing method thereof

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Embodiment Construction

[0014] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0015] The invention provides a manufacturing method of a coil, which can produce various high-precision coils in batches, high efficiency, and low cost through a wafer process. The coil can be used to generate or induce electromagnetic fields, and can be applied to inductive devices. Fluxgate sensors, electromagnetic induction coils, radio frequency transceivers and / or integrated circuit inductors.

[0016] figure 1 It is a schematic diagram of the manufacturing process in the first embodiment of a coil manufacturing method involved in the present invention. The coil is a chip-level coil, which can be made very small and can be integrated in a ...

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Abstract

The invention relates to a coil and a manufacturing method thereof. The manufacturing method of the coil comprises the steps of depositing metal on the first surface of a wafer, and patterning to obtain first surface patterned metal; etching a through hole on the second surface of the wafer, wherein the through hole extends from the second surface to the first surface; depositing metal on the second surface of the wafer etched with the through hole, and patterning to obtain through hole metal and second surface patterned metal; and scribing the wafer to obtain a plurality of mutually independent coils, wherein each coil includes the first surface patterned metal, the through hole metal and the second surface patterned metal, and the first surface patterned metal is interconnected with thesecond surface patterned metal through the through hole metal. The manufacturing method in the invention can efficiently manufacture high-precision coils in batches at low cost through a wafer process, and the coil can be used for generating or inducing an electromagnetic field.

Description

technical field [0001] The invention relates to the field of micro devices, in particular to a coil and a manufacturing method thereof. Background technique [0002] As one of the electronic components, coils are widely used in inductance devices. However, how to produce high-precision coils in batches with high efficiency and low cost has always been a difficulty. [0003] Therefore, it is necessary to propose a solution to solve the above problems. Contents of the invention [0004] The purpose of the present invention is to provide a coil and a manufacturing method thereof, which can produce high-precision coils in batches, efficiently and at low cost through wafer technology. [0005] In order to solve the above-mentioned technical problem, according to one aspect of the present invention, the present invention proposes a method for manufacturing a coil, which includes: depositing metal on the first surface of the wafer and patterning it to obtain the patterned metal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/04H01F5/00H01F27/28H01L23/522G01R33/00
CPCH01F41/041H01F5/003H01F27/2804H01L28/10H01L23/5227G01R33/0052H01F41/042H01F17/0013H01F2017/004H01F41/0206H01F2027/2809
Inventor 蒋乐跃李大来亚历克斯·瑞宾斯基
Owner ACEINNA TRANSDUCER SYST CO LTD