Mating structure for superconducting quantum processor package and package body

Abstract

The present invention provides a mating structure for a superconducting quantum processor package and a package body. The mating structure comprises: a first package portion; a second package portionoppositely arranged with the first package portion, wherein the second package portion and the first package portion form a cavity; a fan-out circuit board located in the cavity and supported by the second package portion; and a metal pad layer tightly pasted to the position between the first package portion and the fan-out circuit board, wherein the coefficient of thermal expansion of the metal pad layer is smaller than the coefficients of thermal expansion of the first package portion and the second package portion to achieve tight cooperation of the first package portion and the fan-out circuit board. Through adoption of a mode of cooperation of the first package box body and the fan-out circuit board, and the metal pad layer is added between the first package box body and the fan-out circuit board to effectively reduce or eliminate the gap between the upper cover and the fan-out circuit board in a very low-temperature environment, improve the grounding effect of the fan-out circuitboard and suppress or eliminate the microwave resonance caused by the existence of the gap, thereby improving the performance of the quantum processor.

Description

technical field [0001] The disclosure belongs to the technical field of integrated circuit packaging, and relates to a matching structure and a packaging box for superconducting quantum processor packaging. Background technique [0002] A superconducting quantum processor is a microwave device that works in an extremely low temperature environment (close to absolute zero, with a typical temperature below 1K). The core component of the superconducting quantum processor is the superconducting quantum chip, which communicates with the peripheral circuit through the fan-out circuit board inside the packaging box to realize the control and reading of qubits. Contents of the invention [0003] (1) Technical problems to be solved [0004] This disclosure provides a matching structure and packaging box for superconducting quantum processor packaging to solve the following technical problems: In the prior art, due to the shrinkage effect of materials at extremely low temperatures,...

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Problems solved by technology

[0004] This disclosure provides a matching structure and packaging box for superconducting quantum processor packaging to solve the following technical problems: In the prior art, due to the shrinkage effect of materials at extremely low temperatures There is a gap between the fan-out circuit board and the upper cover, which may cause poor grounding of the fan-out circuit board or may form microwave resonance, which will affect the performance of the superconducting quantum processor

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