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Mating structure for superconducting quantum processor package and package body

A quantum processor and matching structure technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as microwave resonance, poor grounding of fan-out circuit boards, and affecting the performance of superconducting quantum processors. , to achieve the effect of eliminating microwave resonance, improving grounding effect and improving performance

Pending Publication Date: 2019-11-08
UNIV OF SCI & TECH OF CHINA
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Problems solved by technology

[0004] This disclosure provides a matching structure and packaging box for superconducting quantum processor packaging to solve the following technical problems: In the prior art, due to the shrinkage effect of materials at extremely low temperatures There is a gap between the fan-out circuit board and the upper cover, which may cause poor grounding of the fan-out circuit board or may form microwave resonance, which will affect the performance of the superconducting quantum processor

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  • Mating structure for superconducting quantum processor package and package body
  • Mating structure for superconducting quantum processor package and package body

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no. 1 example

[0030] In a first exemplary embodiment of the present disclosure, a mating structure for superconducting quantum processor packaging is provided.

[0031] figure 2 It is a schematic diagram of a matching structure used for packaging a superconducting quantum processor shown in an embodiment of the present disclosure.

[0032] refer to figure 2 As shown, the matching structure for superconducting quantum processor packaging of the present disclosure includes: a first packaging part 11; a second packaging part 13, which is arranged opposite to the first packaging part 11, and the second packaging part 13 A cavity is formed with the first package part 11; the fan-out circuit board 2 is located in the cavity and carried by the second package part 13; and the metal pad layer 3 is closely attached to the first package part 11 and Between the fan-out circuit boards 2, wherein the thermal expansion coefficient of the metal pad layer is smaller than the thermal expansion coefficien...

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Abstract

The present invention provides a mating structure for a superconducting quantum processor package and a package body. The mating structure comprises: a first package portion; a second package portionoppositely arranged with the first package portion, wherein the second package portion and the first package portion form a cavity; a fan-out circuit board located in the cavity and supported by the second package portion; and a metal pad layer tightly pasted to the position between the first package portion and the fan-out circuit board, wherein the coefficient of thermal expansion of the metal pad layer is smaller than the coefficients of thermal expansion of the first package portion and the second package portion to achieve tight cooperation of the first package portion and the fan-out circuit board. Through adoption of a mode of cooperation of the first package box body and the fan-out circuit board, and the metal pad layer is added between the first package box body and the fan-out circuit board to effectively reduce or eliminate the gap between the upper cover and the fan-out circuit board in a very low-temperature environment, improve the grounding effect of the fan-out circuitboard and suppress or eliminate the microwave resonance caused by the existence of the gap, thereby improving the performance of the quantum processor.

Description

technical field [0001] The disclosure belongs to the technical field of integrated circuit packaging, and relates to a matching structure and a packaging box for superconducting quantum processor packaging. Background technique [0002] A superconducting quantum processor is a microwave device that works in an extremely low temperature environment (close to absolute zero, with a typical temperature below 1K). The core component of the superconducting quantum processor is the superconducting quantum chip, which communicates with the peripheral circuit through the fan-out circuit board inside the packaging box to realize the control and reading of qubits. Contents of the invention [0003] (1) Technical problems to be solved [0004] This disclosure provides a matching structure and packaging box for superconducting quantum processor packaging to solve the following technical problems: In the prior art, due to the shrinkage effect of materials at extremely low temperatures,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/043
CPCH01L23/3107H01L23/043
Inventor 梁福田杨威风邓辉龚明吴玉林彭承志朱晓波潘建伟
Owner UNIV OF SCI & TECH OF CHINA
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