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Simple detachment mechanism for auxiliary die

A sub-mold and simple technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as low processing efficiency, and achieve the effect of high production efficiency, simple structure and easy operation

Pending Publication Date: 2019-11-15
KUNSHAN BAIAO INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the field of electronic product processing technology, the molding of some electronic components needs the mold clamping operation of the master mold and the sub-mold. After the product is formed, the sub-mold and the master mold need to be separated to take out the product. Using manual labor, the processing efficiency is relatively low

Method used

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  • Simple detachment mechanism for auxiliary die
  • Simple detachment mechanism for auxiliary die
  • Simple detachment mechanism for auxiliary die

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Embodiment Construction

[0030] A preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. However, the scope of protection of the present invention is not limited to the following examples, that is, any simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the description are still within the scope of the patent of the present invention.

[0031] refer to Figure 1-4 , is a simple sub-mould removal mechanism described in the present invention, including a lifting guide module 1, an extrusion module 2 and a side pushing module 3.

[0032] The lifting guide module 1 includes an upper fixing plate 101, a lower fixing plate 102, two connecting fixing plates 103, a jacking cylinder 104, a positioning pin 105, a positioning pin fixing plate 106 and a sub-mould limiting flow channel 107. The plate and the lower fixing plate are arranged at intervals up and down, and the two...

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Abstract

The invention discloses a simple detachment mechanism for an auxiliary die. The simple detachment mechanism for the auxiliary die comprises a lifting guide module, a press-out module and a side-push module, wherein the lifting guide module comprises an upper fixed plate, a lower fixed plate, two connection fixing plates, a jacking cylinder, a location needle, a location needle fixing plate and anauxiliary die limit flowing channel; the press-out module comprises a vertical column, a slide table cylinder, and a press block assembly composed of a first press block, a second press block and an ejection rod; and the side-push module comprises a side-push cylinder, a pusher die connection block, a slide block fixing plate and a linear slide rail assembly. According to the simple detachment mechanism for the auxiliary die, the auxiliary die is separated from a primary die and then pushed out through the coordinated working of the lifting guide module, the press-out module and the side-pushmodule at one side; and the simple detachment mechanism for the auxiliary die has the advantages of being simple in structure, easy to operate, high in automation degree, and high in production efficiency.

Description

technical field [0001] The invention belongs to the technical field of automatic processing equipment, and in particular relates to a simple sub-mould disassembly mechanism. Background technique [0002] In the field of electronic product processing technology, the molding of some electronic components needs the mold clamping operation of the master mold and the sub-mold. After the product is formed, the sub-mold and the master mold need to be separated to take out the product. Using manual labor, the processing efficiency is relatively low. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a simple sub-mold disassembly mechanism, which can greatly improve the processing efficiency by disassembling the sub-mold and the mother mold through automatic equipment. [0004] The technical solution adopted by the present invention in order to solve the technical problem is: a simple sub-mould disassembly mechanism,...

Claims

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Application Information

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IPC IPC(8): B23P19/04
CPCB23P19/04
Inventor 蒲显伟冯善章石磊王超熊祥凯
Owner KUNSHAN BAIAO INTELLIGENT EQUIP CO LTD