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Photonic artificial intelligence chip interconnection device and inter-chip interconnection photonic artificial intelligence chip

A technology of artificial intelligence and photonics, applied in light guides, optics, optical components, etc., can solve problems such as interconnection effect and calculation impact between photonic artificial intelligence chips, difficulty in synchronizing optical information, increasing wiring complexity, etc. Interconnection effects and computing performance, avoiding out-of-synchronization problems, and simplifying the effect of wiring design

Active Publication Date: 2020-07-17
光子算数(北京)科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the parallel interface is used for optical communication, if the distance between chips is relatively large, the synchronization of optical information will change due to problems such as transmission distance, optical loss (the longer the transmission distance, the greater the optical loss), crosstalk and noise. It is very difficult (that is, it will lead to out-of-synchronization problems), and this will have a certain impact on the inter-chip interconnection effect and calculation of photonic artificial intelligence chips
In addition, the method of using parallel interface for optical communication to realize inter-chip interconnection will also increase the complexity of wiring due to the large number of transmission lines.

Method used

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see figure 1 , which shows a schematic structural diagram of a photonic artificial intelligence chip interconnection device provided by an embodiment of the present invention, which may include:

[0031] Parallel transmission lines 10 for one-to-one connection with multiple transmission ports of the photonic artificial intelligence chip; wherein, the transmission ports are used to transmit optical signals;

[0032] A delay unit 11 arranged on a preset ...

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Abstract

The invention discloses a photonic artificial intelligence chip interconnection device, an inter-chip interconnected photonic artificial intelligence chip and an inter-chip interconnection system. Thephotonic artificial intelligence chip interconnection device comprises: parallel transmission lines connected in one-to-one correspondence with a plurality of transmission ports of the photonic artificial intelligence chip, wherein the transmission ports are used for transmitting optical signals; delay units which are arranged on a preset number of parallel transmission lines and used for delaying optical signals transmitted by the parallel transmission lines; and a serial transmission line connected to each parallel transmission line for transmitting optical signals. According to the technical scheme disclosed by the application, the mutual conversion between the parallel form and the serial form of the optical signals transmitted by the photonic artificial intelligence chip is realizedby using the parallel transmission lines, the delay units and the serial transmission line, so as to avoid the step failing out problem of the photonic artificial intelligence chip caused by using theparallel interface to achieve inter-chip interconnection to the greatest extent; therefore, the inter-chip interconnection effect and computing performance of the photonic artificial intelligence chip are improved, and the complexity of inter-chip interconnection wiring is reduced.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, and more specifically, to a photonic artificial intelligence chip interconnection device, an inter-chip interconnect photonic artificial intelligence chip, and an inter-chip interconnection system. Background technique [0002] In the calculation of photonic artificial intelligence chips, when the performance of a single-core chip is insufficient, it is often necessary for multiple photonic artificial intelligence chips to jointly complete the calculation task, which involves data transmission between multiple photonic artificial intelligence chips (that is, inter-chip Data transmission), which involves the interconnection between multiple photonic artificial intelligence chips (referred to as inter-chip interconnection), wherein each photonic artificial intelligence chip contains multiple independent transmission lines when connected to other photonic smart chips. The optical path...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/293G06F15/163
CPCG02B6/29338G02B6/2934G06F15/163
Inventor 杨钊赵斌白冰
Owner 光子算数(北京)科技有限责任公司
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