Adhesive layer based on epoxy adhesive

A technology of epoxy adhesive and bonding layer, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problem of not being able to guarantee the curing of the adhesive at the same time, affecting the performance of the bonding layer, etc., and achieve good shear force damage. , excellent mechanical properties, the effect of improving thermal stability

Active Publication Date: 2019-11-22
JIANGNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when preparing a functionally gradient adhesive layer, the adhesives on both sides of the adhesive layer and the adhesive in the middle usually use different types of adhesives, such as polyurethane adhesives on both sides and epoxy adhesives in the middle. Different curing conditions make it impossible to ensure that both adhesives are fully and effectively cured at the same time, which affects the performance of the final bonding layer

Method used

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  • Adhesive layer based on epoxy adhesive
  • Adhesive layer based on epoxy adhesive
  • Adhesive layer based on epoxy adhesive

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Embodiment Construction

[0028] See figure 1 and figure 2 , a bonding layer based on epoxy adhesive of the present invention, which is solidified by unmodified epoxy adhesive 1, modified epoxy adhesive 2 and unmodified epoxy adhesive 1 arranged in sequence along the length direction of the bonding layer Formed; the length ratio of unmodified epoxy adhesive 1, modified epoxy adhesive 2 and unmodified epoxy adhesive 1 is a:b:c=1:(1~3):1, within this ratio range Functionally gradient adhesive layer with good mechanical properties, the width w and thickness h of unmodified epoxy adhesive 1, modified epoxy adhesive 2 and unmodified epoxy adhesive 1 are all equal; modified epoxy adhesive 2 is composed of unmodified epoxy adhesive Graphene nanosheets are uniformly dispersed in the unmodified epoxy adhesive; unmodified epoxy adhesive 1 is prepared by epoxy resin and curing agent in proportion ; In the modified epoxy adhesive, the quality of the graphene nanosheets accounts for 0.25% to 0.75% of the mass of...

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Abstract

The invention provides an adhesive layer based on an epoxy adhesive, which can solve the problems that the engineering technical requirements are difficult to meet by adopting the existing epoxy adhesive as the adhesive layer, and the cost is higher when the adhesive layer is prepared by completely using the modified epoxy adhesive. The adhesive layer is formed by curing an unmodified epoxy adhesive, a modified epoxy adhesive and an unmodified epoxy adhesive which are sequentially arranged in the length direction of the adhesive layer, the modified epoxy adhesive is prepared from the unmodified epoxy adhesive and the graphene nanosheets in proportion, and the graphene nanosheets are uniformly dispersed in the unmodified epoxy adhesive.

Description

technical field [0001] The invention relates to the field of bonding structures, in particular to a bonding layer based on epoxy adhesive. Background technique [0002] The adhesive structure is widely used in various fields, such as civil engineering, aerospace and medicine, because of its advantages of light weight, no damage to the continuity of the bonded parts, and uniform stress distribution of the bonded joint. The actual strength of the bonded structure is mainly determined by the performance of the bonded parts and the bonded layer. The bonded layer is usually the weakest part of the entire bonded structure and is most prone to damage. Therefore, it is necessary to explore and improve the strength of the bonded layer The mechanical properties are of great significance. [0003] Epoxy adhesives have excellent mechanical properties and bonding properties, and are polymer thermosetting materials that have been widely used in recent years. It is a curing system compos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J7/00C09J163/00C09J11/04
CPCC08K2201/011C09J7/00C09J11/04C09J163/00C09J2463/00C09J7/30C09J2301/21C08K7/00C08K3/042
Inventor 贾哲敏虞晶燕
Owner JIANGNAN UNIV
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