Automatic injection molding system for semiconductor component packaging and working method of automatic injection molding system

A technology of injection molding system and working method, applied in coating and other directions, which can solve the problems of poor quality consistency and labor-intensive
CN110497577AInactive Publication Date: 2019-11-26苏州旭芯翔智能设备有限公司
10 Cites 4 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
苏州旭芯翔智能设备有限公司
Publication Date
2019-11-26
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses an automatic injection molding system for semiconductor component packaging and a working method of the automatic injection molding system. The automatic injection molding system comprises an injection molding press unit (1), a multi-cylinder injection mold unit (2), a mold cleaning unit (3), a product feeding unit (4), a product heating unit (5), an epoxy resin feeding unit (6), a material conveying unit (7), a flow passage transfer station (8), a flow passage mechanism unit (9), a product discharging unit (10) and a central control unit (11), and the central control unit controls the operation of each unit. By adopting the mode that the multi-cylinder injection mold is automatically operated, only manual emptying and material taking are needed, so that the production process automation is realized, the consistency of the product quality is improved, the production efficiency is improved, and the labor is saved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of packaging production of semiconductor components, in particular to an automatic injection molding system for packaging semiconductor components and a working method thereof. Background technique

[0002] To complete the packaging and production of semiconductor components, it needs to go through many processes, generally including chip welding, wire welding / slip welding / two-piece frame superposition welding, cleaning, injection molding, curing, electroplating, rib cutting and separation and testing. . At present, in the packaging production process of semiconductor components, many processes have realized the automatic operation of the equipment, and the operator only needs to be responsible for the work of discharging and retrieving materials. At present, most packaging companies use multi-cylinder injection molds and manual operation. Although the efficiency is relatively high, manual operation leads to poor pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More