Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic injection molding system for semiconductor component packaging and working method of automatic injection molding system

A technology of injection molding system and working method, applied in coating and other directions, which can solve the problems of poor quality consistency and labor-intensive

Inactive Publication Date: 2019-11-26
苏州旭芯翔智能设备有限公司
View PDF10 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most packaging companies use multi-cylinder injection molds and manual operation. Although the efficiency is relatively high, manual operation leads to poor product quality consistency, and one person can only operate one device, which is labor-intensive.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic injection molding system for semiconductor component packaging and working method of automatic injection molding system
  • Automatic injection molding system for semiconductor component packaging and working method of automatic injection molding system
  • Automatic injection molding system for semiconductor component packaging and working method of automatic injection molding system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The technical solution of the present invention will be described in further non-limiting detail below in combination with preferred embodiments and accompanying drawings.

[0026] Such as figure 1 , figure 2 The semiconductor component packaging automatic injection molding system shown includes injection molding press unit 1, multi-cylinder injection mold unit 2, mold cleaning unit 3, product feeding unit 4, product heating unit 5, epoxy resin feeding unit 6, material The transportation unit 7, the transfer station 8 to the runner, the mechanism unit 9 to the runner, the product unloading unit 10, the central control unit 11 and the rack platform 12 required by each system.

[0027] The product loading unit 4 includes a material box transportation input device, a material box lifting control device 4a, a product pushing mechanism and a material box transportation output device 4b. Carry the material box full of products to the corresponding position of the product e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic injection molding system for semiconductor component packaging and a working method of the automatic injection molding system. The automatic injection molding system comprises an injection molding press unit (1), a multi-cylinder injection mold unit (2), a mold cleaning unit (3), a product feeding unit (4), a product heating unit (5), an epoxy resin feeding unit (6), a material conveying unit (7), a flow passage transfer station (8), a flow passage mechanism unit (9), a product discharging unit (10) and a central control unit (11), and the central control unit controls the operation of each unit. By adopting the mode that the multi-cylinder injection mold is automatically operated, only manual emptying and material taking are needed, so that the production process automation is realized, the consistency of the product quality is improved, the production efficiency is improved, and the labor is saved.

Description

technical field [0001] The invention relates to the field of packaging production of semiconductor components, in particular to an automatic injection molding system for packaging semiconductor components and a working method thereof. Background technique [0002] To complete the packaging and production of semiconductor components, it needs to go through many processes, generally including chip welding, wire welding / slip welding / two-piece frame superposition welding, cleaning, injection molding, curing, electroplating, rib cutting and separation and testing. . At present, in the packaging production process of semiconductor components, many processes have realized the automatic operation of the equipment, and the operator only needs to be responsible for the work of discharging and retrieving materials. At present, most packaging companies use multi-cylinder injection molds and manual operation. Although the efficiency is relatively high, manual operation leads to poor pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/03B29C45/17B29C45/14B29C45/18B29C45/72B29C45/38
CPCB29C45/03B29C45/14B29C45/17B29C45/1753B29C45/18B29C45/382B29C45/7207
Inventor 李杰
Owner 苏州旭芯翔智能设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com