Cavity device for preventing electronic device from being damaged due to overheating
A technology for electronic devices and cavities, which is applied to electrical components, electrical equipment structural parts, electrical equipment shells/cabinets/drawers, etc. Good, bad force at the joints of parts, etc., to reduce the temperature, enhance the structural strength, and reduce the production process.
Inactive Publication Date: 2019-12-03
眭书剑
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Problems solved by technology
[0002] Most of the existing shells are assembled structures, which are not only inconvenient to assemble, but also the joints of the parts are not well stressed, and cannot play a good role in sealing, mechanical support and physical protection; in addition, the existing metal packaging shells generally have heat dissipation. Not good, the surface temperature is too high, and the continuous high temperature will cause irreversible damage to the electronic components inside the package
Method used
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Embodiment
[0021] like figure 1 and figure 2 As shown, this embodiment provides a cavity device for preventing electronic devices from being damaged by overheating. A concave cavity 1 is provided on the upper surface of the cavity body. The cavity body is an integrated structure. The left outer side and the right outer side of the cavity body are respectively A first groove 2 is provided, and a plurality of cooling fins 3 are arranged in the first groove 2; a plurality of second grooves 4 are respectively arranged on the left outer surface and the right outer surface of the cavity body, and the second grooves 4 does not intersect with the first groove 2; the lower surface of the cavity body is arc-shaped, and the lower surface of the cavity body is provided with a plurality of second grooves 4; in addition, the first groove 2, the heat sink 3 and the second The surfaces of the two grooves 4 are all coated with heat-dissipating paint.
[0022] The front side of the cavity body is provi...
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Abstract
The invention discloses a cavity device for preventing an electronic device from being damaged due to overheating. The cavity device comprises a cavity body, a concave cavity is formed in the upper surface of the cavity body, the cavity body is an integrated structure, the depth of the concave cavity ranges from 1cm to 2cm, the left outer side face and the right outer side face of the cavity bodyare respectively provided with first grooves, and a plurality of cooling fins are arranged in each first groove; a plurality of second grooves are respectively formed in the left outer side surface and the right outer side surface of the cavity body, and the second grooves and the first grooves are not intersected; the lower surface of the cavity body is in an arc shape, a plurality of second grooves are formed in the lower surface of the cavity body, a cover plate is arranged on the cavity, the cover plate is connected with the right side face of the cavity in a hinged mode, and a plurality of ventilation openings are formed in the cover plate and evenly distributed. By means of the integrated cavity with the heat dissipation grooves, one-time packaging forming of a microwave circuit canbe achieved, production procedures are reduced, the heat dissipation area can be increased, and the working reliability of electronic components is improved.
Description
technical field [0001] The invention relates to a cavity device, in particular to a cavity device for preventing electronic devices from being damaged by overheating. Background technique [0002] Most of the existing shells are assembled structures, which are not only inconvenient to assemble, but also the joints of the components are not well stressed, and cannot play a good role in sealing, mechanical support and physical protection; in addition, the existing metal packaging shells generally have heat dissipation. Not good, the surface temperature is too high, and the continuous high temperature will cause irreversible damage to the electronic components inside the package. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a cavity device that prevents electronic devices from being damaged by overheating. Forming can reduce the production process, increase the heat...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20H05K5/02
CPCH05K7/20409H05K5/0213H05K5/0247H05K5/03
Inventor 眭书剑
Owner 眭书剑