Heat dissipation device combination structure

Abstract

The invention provides a heat dissipation device combination structure, which comprises a first plate body, a second plate body, and a combination component, wherein the first plate body has a first side and a second side; the second plate body has a third side and a fourth side; the third side is covered with the first side correspondingly; the first plate body and the second plate body jointly define a closed chamber; the fourth side has a heating part which is in contact with at least one heating source for heat conduction; the combination component is arranged adjacent to the heating partand is combined with the heating source. As the heat dissipation device and the heating source are directly connected through the combination component, so that the two have a tighter degree of combination to prevent generation of thermal resistance, and vacuum leakage of the heat dissipation device can be prevented without penetrating the heat dissipation device.

Description

technical field [0001] The invention relates to a combination structure of a heat dissipation device, in particular to a combination structure of a heat dissipation device that can be tightly combined with a heat source without passing through the heat dissipation device with an airtight chamber. Background technique [0002] As the efficiency of current electronic equipment improves, the electronic components used for signal processing and calculation also generate higher heat than the previous electronic components. The most commonly used general heat dissipation components include heat pipes, radiators, vapor chambers and other components. , and further increase the heat dissipation performance by directly contacting the electronic components that will generate heat, so as to prevent the electronic components from being burned due to excessive temperature. [0003] Vapor chamber is a heat conduction application with a wide range of surface to surface, which is different f...

AI Technical Summary

Problems solved by technology

[0004] In the existing system, the vapor chamber is used in combination with a substrate and the heat of the heating element on the substrate is conducted through the vapor chamber. The existing technology is mainly based on the position where the vapor chamber avoids the chamber, that is, the vapor chamber is closed. Each of the four couplings outside the center is formed with a perforation and a copper column with internal threads. At least one hole is opened on the base plate relative to the position of the copper column on the uniform temperature plate, and then a screw lock element is used to screw lock simultaneously. The vapor chamber is fixed on the substrate by piercing the copper pillars and holes. However, because the copper pillars are arranged at the four couplings of the vapor chamber, the distance between the vapor chamber and the heating element is relatively long. After being fixed, it cannot be closely attached to the heating element, resulting in thermal resistance; in order to improve the aforementioned problem of not being able to adhere tightly, the industry will directly arrange the copper pillars in the vicinity of the position where the vapor chamber is attached to the heating element. Therefore, these copper pillars directly penetrate through the cavity of the chamber. Although it can increase the tightness during assembly to prevent thermal resistance, the chamber of the chamber of the chamber will lose its airtightness after being penetrated by these copper pillars. , the inside of the chamber no longer has a vacuum state, and because the copper pillar penetrates and destroys the chamber, the flow path of the working fluid inside may be blocked, resulting in a decrease in heat transfer efficiency, and even serious leakage may occur, which in turn causes The vapor chamber loses its heat transfer effect

[0005] Furthermore, U.S. Patent Nos. 7,066,240, 6,302,192, and 7,100,680 disclose a vapor chamber structure. Referring to Figures 9 and 10 of the U.S. Patent, a body 51 has a first flat plate 511 and a second flat plate 512 that are separated from each other. And an outer protrusion 513 is provided on the periphery of the body, so that the outer protrusion 513 is connected to form a closed chamber 514; a groove 5111 is located on the first flat plate 511 and is far away from the outer protrusion 513, and is connected with the outer protrusion 513. The second flat plate 512 is connected; an opening 52 penetrates the groove 5111 of the first flat plate 511 and the second flat plate 512, and the groove 5111 includes an annular outer surface 5112, and is in phase with one on the second flat plate 512. The corresponding ring-shaped edge surface 5121 is connected so that the opening 52 is independently isolated from the body 51; a spacer 53 extends and contacts between the first flat plate 511 and the second flat plate 512; a capillary fiber structure 54 is arranged in the closed cavity Chamber 514, although this structure has a support structure and an airtight effect by virtue of the design of the groove 5111, but the chamber space for the vapor-liquid circulation inside the chamber is greatly reduced due to the arrangement of the groove, relatively Due to the setting of the groove, the contact area between the vapor chamber and the heat source becomes smaller, so not only the heat transfer efficiency is reduced, but also the contact area is greatly reduced

[0006] Therefore, the prior art has the following disadvantages: 1. It is easy to generate thermal resistance; 2. The heat dissipation area is reduced; 3. The heat transfer efficiency is reduced

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