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Shielding assembly and electrolytic device using shielding assembly

A component and electrolyte technology, applied in electrolysis process, electrolysis components, removal of conductive materials by chemical/electrolytic methods, etc., can solve the problem of edge effect affecting etching effect, etc., and achieve uniform etching effect and high safety effect

Pending Publication Date: 2019-12-20
KUNSHAN DONGWEI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the electrolytic etching plate is prone to edge effects and affect the etching effect in the prior art, thereby providing a new combined shielding assembly

Method used

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  • Shielding assembly and electrolytic device using shielding assembly
  • Shielding assembly and electrolytic device using shielding assembly
  • Shielding assembly and electrolytic device using shielding assembly

Examples

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Embodiment 1

[0047] The present invention describes an electrolysis device, such as Figure 4 As shown, it comprises electrolytic cell 6, cathode part 61 and workpiece 62 to be etched that stretch into the electrolytic solution in electrolytic tank 6; The tank 6 is soaked in the electrolyte, and the piece to be etched 62 is conductively connected with the anode 63 to realize the conductive communication with the electrolyte.

[0048] Both the cathode part 61 and the part to be etched 62 are submerged in the electrolytic solution. After energization, the positive ions on the part to be etched 62 are oxidized and electrolyzed to attach to the cathode part 61. The part to be etched 62 in this embodiment is a PCB board. Electrolysis transfers the exposed copper on the surface layer of the PCB to the cathode member 61 , thereby electrolytically etching the exposed copper layer on the PCB to form the required circuit.

[0049] In this embodiment, there is also a shielding assembly disposed betw...

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PUM

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Abstract

The invention discloses a shielding assembly, belongs to the technical field of electrolytic etching, and is used for solving the problem of uneven surface reaction of a piece to be etched. Accordingto the technical scheme, the shielding assembly is characterized by comprising a rack, a shielding unit and a floating shielding unit, wherein the shielding assembly is arranged on the rack and between the end part of a cathode piece and the piece to be etched so as to slow down the flow of electrolyte between the end part of the cathode piece and the piece to be etched; the piece to be etched iselectrically connected with an anode; the floating shielding unit is driven by a lifting unit to move up and down between the cathode piece and the piece to be etched so as to adjust the blocking position of the floating shielding unit; and the floating shielding unit is at least correspondingly arranged at the end part of the piece to be etched so as to slow down the flow of the electrolyte between the cathode piece and the end part of the piece to be etched.

Description

technical field [0001] The invention relates to the technical field of electrolytic etching, in particular to a shielding component and an electrolytic device for its application. Background technique [0002] Electrolytic etching is used for the first time in the production process of PCB boards. It refers to the electrolysis of PCB boards. The board to be etched is used as the anode, and the stainless steel plate or pure copper plate is used as the cathode. The anode is connected to the positive pole of the power supply, and the cathode is connected to the negative pole of the power supply. The anode and the The cathodes are immersed in an electrolyte solution. When the current passes through the electrode and the electrolyte solution, an electrochemical reaction occurs on the surface of the electrode and in the electrolyte solution. This reaction is used to remove the exposed copper on the PCB surface to be etched, so that the exposed copper on the PCB surface is corroded...

Claims

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Application Information

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IPC IPC(8): C25F7/00C25F3/02H05K3/07
CPCC25F7/00C25F3/02H05K3/07H05K3/061
Inventor 刘建波朱爱明吴志鹏
Owner KUNSHAN DONGWEI MACHINERY CO LTD
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