A method for improving the efficiency of circuit board silk screen soldering resistance

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a method for improving the efficiency of silk screen soldering resistance of circuit boards. In the present invention, when the solder resist ink is screen-printed on the second surface of the PCB production board, the screen printing auxiliary board provided with a support block is used in conjunction with the screen printing on the second surface immediately after the solder resist ink is screen-printed on the first surface without standing still Waiting for the solder resist ink on the first surface to dry and pre-baking before proceeding to silk screen printing on the second surface can not only save the time of first standing and pre-baking, improve production efficiency, but also avoid copper surface on the second surface Exposure to warm and humid air causes oxidation and introduces quality hazards. At the same time, it can also make the solder resist inks on both surfaces the same factors affected by pre-baking, which is conducive to the control of the subsequent development process and develops solder resists with higher precision. Floor.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for improving the efficiency of silk screen soldering resistance of circuit boards. Background technique [0002] In the field of circuit board production, circuit board solder mask refers to the coating of solder resist ink on the circuit and substrate that does not need to be welded on the board surface to form a protective layer that prevents bridging between circuits during soldering, and serves as a permanent It is a protective layer for the permanent electrical environment and chemical corrosion resistance, and the solder mask of the circuit board also plays a role in beautifying the appearance. Soldering of circuit boards is generally done by screen printing followed by alignment exposure and development, so it is also called silk screen soldering. In addition to traditional single-sided boards, double-sided boards and multi-layer boards require si...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the current silk screen solder resist method for double-sided circuit boards needs to carry out two standing and pre-baking processes, the efficiency is low, and the copper surface on the side that has not yet been silk screen solder resist ink is prone to oxidation and leads to quality problems. It provides A method that can improve the efficiency of silk screen solder masking of circuit boards by only one static and pre-baking treatment

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