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Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

A technology for manufacturing devices and semiconductors, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficult fluid flow of wafers

Active Publication Date: 2019-12-27
KIOXIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, there is the problem of creating areas on the wafer where fluid flow continues and areas where fluid flow is difficult

Method used

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  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0019] figure 1 It is a schematic diagram which shows the structure of the semiconductor manufacturing apparatus of 1st Embodiment. figure 1 The semiconductor manufacturing apparatus of the present invention is a batch-type substrate processing apparatus that processes a plurality of substrates (wafers) 1 with a substrate processing liquid 2 .

[0020] figure 1 The semiconductor manufacturing apparatus includes a substrate processing tank 11 , a substrate holding unit 12 , an overflow unit 13 , a circulation channel 14 , a pump 15 , a heating unit 16 , a purification unit 17 , a plurality of nozzles 18 , a control unit 19 and a water level sensor 20 . The nozzle 18 is an example of a fluid ejection portion.

[0021] figure 1 The X direction and the Y direction which are substantially parallel to the installation surface of the semiconductor manufacturing apparatus and are perpendicular to each other, and the Z direction which is substantially perpendicular to the installat...

no. 2 Embodiment approach

[0053] 6 is a perspective view and a cross-sectional view showing the configuration of the nozzle 18 according to the second embodiment.

[0054] The nozzle 18 of this embodiment is provided with the injection member 24 shown to FIG.6(a) - FIG.6(c), and the piping 25 shown to FIG.6(c). As shown in FIG.6(c), the injection member 24 is attached to the side surface of the piping 25. The liquid 2 of the present embodiment flows in the piping 25 , flows from the piping 25 into the ejection member 24 , and is ejected from the ejection member 24 to the surface of each substrate 1 .

[0055] As shown in FIG. 6( a ), the ejection member 24 includes a row of inlets 24 a , an outlet 24 b of a row, a first ejection flow path 24 c , a second ejection flow path 24 d , a first circulation flow path 24 e , and a second circulation flow path 24 f . The first and second jet flow paths 24c and 24d are examples of first flow paths, and the first and second circulation flow paths 24e and 24f are...

no. 3 Embodiment approach

[0069] 10 is a perspective view and a cross-sectional view showing the configuration of the nozzle 18 according to the third embodiment.

[0070]As shown in FIGS. 10( a ) to 10 ( c ), the nozzle 18 of the present embodiment includes: one pipe 26 having a tubular shape; one first member 27 having a plate-like shape; 2. The member 28 has a rod-like shape.

[0071] As shown in FIG. 10( a ), the space inside the piping 26 is divided into a lower space that functions as a first flow path for transferring the liquid 2 , and a second flow path that functions as a second flow path through which the liquid 2 flows from the first flow path. the upper space. The first flow path and the second flow path are divided by the first member 27 provided in the piping 26 . On the other hand, the two second members 28 are provided in the second flow path in parallel with each other.

[0072] As shown in FIG.10(c), the piping 26 is provided with the 1st hole 26a of 1 row, and the 1st member 27 i...

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PUM

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Abstract

The embodiment of the invention provides a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device. In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.

Description

[0001] Related applications [0002] This application enjoys priority based on Japanese Patent Application No. 2018-116357 (filing date: June 19, 2018). The present application includes the entire contents of the basic application by referring to the basic application. technical field [0003] Embodiments relate to a semiconductor manufacturing apparatus and a method of manufacturing the semiconductor device. Background technique [0004] When a fluid such as a liquid or a gas is supplied to the wafer from the nozzle, there is a problem that the amount of fluid supplied varies among regions on the wafer. For example, there is a problem of creating regions on the wafer where fluid flows continuously, and regions where fluid flow is difficult. SUMMARY OF THE INVENTION [0005] Embodiments provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor apparatus capable of reducing the variation in the amount of fluid supplied between regions ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67051H01L21/67057H01L21/02041H01L21/306H01L21/68771H01L21/6708H01L21/67086
Inventor 杉田智彦佐藤胜广芦立浩明
Owner KIOXIA CORP