Resin molding apparatus and method for producing resin molded product
A technology of resin molding and manufacturing methods, which is applied in the field of resin molding equipment and resin molding products, and can solve problems such as inability to protect molds, mold damage, and unbalanced mold clamping pressure.
Active Publication Date: 2022-05-10
TOWA
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Problems solved by technology
At this time, when the mold clamping pressure normally used for resin sealing is applied, the mold may be damaged due to uneven mold clamping pressure caused by foreign matter.
In the conventional method of moving the movable platen up and down using only the toggle mechanism, considerable mold clamping force is generated at the position where the upper mold and the lower mold are in contact, and it is impossible to detect the mold by foreign object detection under the low-pressure mold clamping state. Protect
Method used
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[0071] Regarding the embodiment of the present invention, while referring to the attached Figure 1 side in detail. In addition, about the same or corresponding part in a figure, the same code|symbol is attached|subjected, and the description is not repeated.
[0072]
[0073] First, a configuration example of the resin molding apparatus 1 according to the present embodiment will be described. Typically, the resin molding apparatus 1 according to the present embodiment is used as a device for resin-sealing the molding object by molding resin on a chip arrangement surface of the molding object such as a lead frame on which chips are arranged. The resin molding apparatus 1 can also be comprised as a part of manufacturing apparatus of an electronic component. In the following description, a lead frame is shown as a typical example of the object to be molded, but it is not limited thereto, and may be another support such as a substrate.
[0074] Chips of electronic components i...
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The present invention relates to a resin molding device and a method for manufacturing a resin molded product. The resin molding device includes a mold clamping mechanism that changes the distance between a first mold and a second mold, and a control unit that controls the mold clamping mechanism. The control unit executes the process of reducing the distance between the first mold and the second mold while the object to be molded is arranged in the molding mold, and measuring the mold clamping force, which is the pressure applied to the molding mold by the mold clamping mechanism; the first position of the mold clamping mechanism at which the measured clamping force exceeds the preset first set value; the second position obtained by correcting the first position with the correction value is set as the foreign object detection position; and during the forming action In , foreign objects in the molding die are detected based on the mold clamping force measured at the foreign object detection position.
Description
technical field [0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background technique [0002] In order to protect semiconductor chips such as integrated circuits (Integrated Circuit, IC) from environmental influences such as light, heat, moisture, etc., the semiconductor chips are usually sealed with resin. Such resin sealing is achieved by disposing a support on which a semiconductor chip is mounted between molding dies including an upper mold and a lower mold, and filling a cavity including the molding die with molten resin. Alternatively, there is also known a method of supplying and heating a granular resin material to the lower mold in advance, and simultaneously clamping both molds. [0003] In order to carry out this kind of resin sealing, it is necessary to arrange the support body on which the semiconductor chip is mounted between the upper mold and the lower mold. However, for some reason, in ad...
Claims
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IPC IPC(8): B29C43/18B29C43/58H01L21/56B29L31/34
CPCB29C43/18B29C43/58H01L21/56B29C2043/585B29L2031/3425H01L2924/181H01L2224/48091H01L2924/00012H01L2924/00014B29C43/04B29C43/3607H01L21/67126H01L23/28H01L21/565B29C2043/5833
Inventor 小河冬彦尾川敬祐田锹直久清水久胜
Owner TOWA