A radio frequency backplane and backplane assembly

Abstract

The invention relates to a radio frequency backboard and a backboard assembly. The radio frequency backboard comprises a printed board. The printed board is provided with radio frequency chains. Eachradio frequency chain comprises an inner bonding pad, an outer bonding pad and a strip line, wherein the inner bonding pad and the outer bonding pad are insulated and separated; the strip line is connected with the inner bonding pad; the outer bonding pad is connected with an upper reference ground and a lower reference ground; the inner bonding pad is used for being connected with an inner conductor of a radio frequency connector; the outer bonding pad is used for being connected with an outer conductor; the strip lines of two adjacent radio frequency chains have parallel sections, and at least two rows of strip line ground holes are formed between the parallel sections; each row of strip line ground holes are parallel to the parallel sections of the strip lines; there are two adjacent rows of strip line ground holes, wherein the strip line ground holes in one row and the strip line ground holes in the other row are staggered in the parallel direction. According to the invention, at least two rows of strip line ground holes are arranged between the two strip line parallel sections, and the strip line ground holes are arranged in a staggered manner, so that effective backflow pathsare increased, the interference of an electromagnetic coupling effect on adjacent signals is reduced, and the isolation between high-frequency signals in the printed circuit board is improved.

Description

technical field [0001] The invention relates to a radio frequency backplane and a backplane assembly. Background technique [0002] In order to solve the integrated interconnection of high-frequency signals in the limited space inside the system and change the current situation that the radio frequency signals between modules are only transmitted by coaxial cable components, a radio frequency backplane transmission technology is proposed. This technology realizes the function of radio frequency signal transmission in the printed circuit board. Radio frequency signals have spatial transmission characteristics, and the isolation between adjacent signals in printed boards has been perplexing the development of this technology. In order to reduce the electromagnetic coupling effect between adjacent signals, the existing technology uses a stripline model for high-frequency signal transmission within 18 GHz. A single row of ground holes for isolation is evenly distributed between...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a radio frequency backplane to solve the problem in the prior art that it is difficult for a single row of ground holes between adjacent signals to meet the isolation for high frequency radio frequency signals; the purpose of the present invention is also to provide a The backplane assembly of the above-mentioned radio frequency backplane is used to solve the problem in the prior art that for high-frequency radio frequency signals, it is difficult to meet the isolation of a single row of ground holes between adjacent signals

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