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High dielectric constant polyamide 6/polyphenylene ether composition and preparation method thereof

A high dielectric constant, polyamide technology, applied in the field of materials, can solve problems such as less research on high dielectric properties, and achieve the effects of improving yellowing phenomenon and thermal stability, increasing dielectric constant, and being easy to control.

Active Publication Date: 2022-04-15
GUANGDONG ALDEX NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are few studies on the high dielectric properties of the PA6 / PPO system in the prior art

Method used

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  • High dielectric constant polyamide 6/polyphenylene ether composition and preparation method thereof
  • High dielectric constant polyamide 6/polyphenylene ether composition and preparation method thereof
  • High dielectric constant polyamide 6/polyphenylene ether composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] In this embodiment, a high dielectric constant polyamide 6 / polyphenylene ether composition is prepared from the following raw materials in parts by weight:

[0071]

[0072] The preparation method of above-mentioned high dielectric constant polyamide 6 / polyphenylene ether composition comprises the following steps:

[0073] (1) After drying the low-viscosity polyamide 6 resin at a temperature of 110°C for 8 hours, and drying the high-viscosity polyphenylene ether resin and low-viscosity polyphenylene ether resin at a temperature of 80°C for 8 hours , cooling, the cooled low-viscosity polyamide 6 resin, high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphate, zinc pentaerythritol, barium titanate, γ-aminopropyl Base triethoxysilane, polyvinylidene fluoride and copper phthalocyanine oligomers are adde...

Embodiment 2

[0078] In this embodiment, a high dielectric constant polyamide 6 / polyphenylene ether composition is prepared from the following raw materials in parts by weight:

[0079]

[0080]

[0081] The preparation method of above-mentioned high dielectric constant polyamide 6 / polyphenylene ether composition comprises the following steps:

[0082] (1) After drying the low-viscosity polyamide 6 resin at a temperature of 140°C for 4 hours, and drying the high-viscosity polyphenylene ether resin and low-viscosity polyphenylene ether resin at a temperature of 110°C for 4 hours , cooling, the cooled low-viscosity polyamide 6 resin, high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphate, zinc pentaerythritol, barium titanate, γ-aminopropyl Base trimethoxysilane, polyvinylidene fluoride and copper phthalocyanine olig...

Embodiment 3

[0087] In this embodiment, a high dielectric constant polyamide 6 / polyphenylene ether composition is prepared from the following raw materials in parts by weight:

[0088]

[0089]

[0090] The preparation method of above-mentioned high dielectric constant polyamide 6 / polyphenylene ether composition comprises the following steps:

[0091] (1) After drying the low-viscosity polyamide 6 resin at a temperature of 120°C for 6 hours, and drying the high-viscosity polyphenylene ether resin and low-viscosity polyphenylene ether resin at a temperature of 90°C for 6 hours , cooling, the cooled low-viscosity polyamide 6 resin, high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphate, zinc pentaerythritol, barium titanate, γ-aminopropyl Base triethoxysilane, polyvinylidene fluoride and copper phthalocyanine oligom...

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Abstract

The invention relates to a high dielectric constant polyamide 6 / polyphenylene ether composition and a preparation method thereof. The high dielectric constant polyamide 6 / polyphenylene ether composition is prepared from the following raw materials: low-viscosity polyamide 6 Resin, high viscosity polyphenylene ether resin, low viscosity polyphenylene ether resin, styrene and glycidyl methacrylate copolymer, toluene diisocyanate, hydrogenated styrene-isoprene copolymer grafted maleic anhydride, N, N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,3-phthalamide, bis(2,6-di-tert-butyl-4-methylphenyl ) Pentaerythritol diphosphate, zinc pentaerythritol, high dielectric constant filler, silane coupling agent, polyvinylidene fluoride, copper phthalocyanine oligomer. The high dielectric constant polyamide 6 / polyphenylene ether composition has excellent mechanical properties, processability and high dielectric constant, and can be used in the fields of communication, fine electrics and the like.

Description

technical field [0001] The invention relates to the field of materials, in particular to a high dielectric constant polyamide 6 / polyphenylene ether composition and a preparation method thereof. Background technique [0002] Polyamide 6 (PA6) is a crystalline resin with excellent chemical resistance and processability, but its high water absorption leads to a decrease in mechanical properties and poor dimensional stability, while polyphenylene oxide (PPO) is an amorphous resin with good mechanical properties and heat resistance, but poor processability, chemical resistance and impact resistance. The preparation of polyamide 6 and polyphenylene ether into a high dielectric constant polyamide 6 / polyphenylene ether composition can overcome the shortcomings of polyamide 6 and polyphenylene ether, and make the composition have high rigidity, low creep, and heat distortion temperature High, impact resistance and good oil resistance and so on. From the perspective of microstructur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/02C08L71/12C08L51/00C08L27/16C08L25/14C08K13/02C08K5/3435C08K5/527C08K5/053
CPCC08L77/02C08L2205/035C08L2201/08C08L2205/08C08L71/12C08L51/006C08L27/16C08L25/14C08K13/02C08K5/3435C08K5/527C08K5/053
Inventor 王忠强杨华军韩春春
Owner GUANGDONG ALDEX NEW MATERIAL CO LTD
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