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Power module and power conversion apparatus

A power module and main conversion technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of narrowing of wiring intervals, residues, bubble retention, etc., and achieve the effect of suppressing the formation of holes

Pending Publication Date: 2020-01-03
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if the number of metal wires in the power module increases due to the diversification of the rated value of the power module and the increase in the current, the interval between the wires may be narrowed, and the Air bubbles become difficult to release from the gaps in the metal wiring, the bubbles remain under the metal wiring, and eventually remain as holes under the metal wiring

Method used

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  • Power module and power conversion apparatus
  • Power module and power conversion apparatus
  • Power module and power conversion apparatus

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0034] figure 1 It is a sectional view of the power module 100 according to Embodiment 1 of the present invention. in addition, figure 2 It is a partial plan view of the power module 100 viewed from above, and the sealing resin and the like are omitted. also, figure 2 The section in the direction of the arrow at the line A-B-A in is figure 1 profile.

[0035] like figure 1 As shown, in the case of the power module 100, the insulating substrate 3 is bonded to the upper surface of the base plate 101 via solder (under-substrate solder) 107b, and the semiconductor element 104 including the switching element 104a and the freewheeling diode 104b is bonded to the upper surface of the base plate 101 via the solder 107a. The upper surface of the insulating substrate 3 (substrate) is bonded. The base plate 101 is housed in the opening on the bottom side of the housing 1, the upper and bottom sides of the housing 1 are openings, and the base plate 101 having the same shape and...

Embodiment approach 2

[0085] In this embodiment, the power module according to Embodiment 1 described above is applied to a power conversion device. Next, as Embodiment 2, a case where Embodiment 1 is applied to a three-phase inverter will be described.

[0086] Figure 22 It is a block diagram showing the configuration of a power conversion system to which the power conversion device according to the present embodiment is applied.

[0087] Figure 22 The illustrated power conversion system is composed of a power source 500 , a power conversion device 600 , and a load 700 . The power supply 500 is a DC power supply, and supplies DC power to the power conversion device 600 . The power supply 500 can be constituted by various power sources, for example, it can be constituted by a DC system, a solar cell, a storage battery, or it can be constituted by a rectifier circuit or an AC / DC converter connected to an AC system. Alternatively, the power supply 500 may be constituted by a DC / DC converter tha...

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PUM

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Abstract

The invention provides a power module which suppresses the formation of holes under metal wiring. The power module includes: a semiconductor element; a substrate on which the semiconductor element ismounted; a wiring part which is composed of a plurality of wiring queues; a case in which the substrate is disposed on the bottom surface side thereof, the case accommodating the semiconductor elementand the wiring portion; and an insulating sealing material which is filled in the housing and in which the plurality of wirings constituting the wiring portion are arranged in a ring shape in the same direction such that the wiring height of each of the wirings gradually increases toward at least one direction of the queue.

Description

technical field [0001] The present invention relates to a power module, and in particular, to a power module in which the formation of voids in an insulating packaging material filled in a case is suppressed. Background technique [0002] In a normal power module, a circuit is formed by electrically connecting a semiconductor element and a circuit pattern on an insulating substrate with metal wiring or the like. However, with the increase in density and reliability in a power module, there are metal wiring connected to the semiconductor element. The number of wires tends to increase, and the arrangement density of metal wiring increases, for example, as in Patent Document 1 Figure 9 As disclosed in A, power modules employing staggered bonding in which bonding positions are shifted little by little are increasing. [0003] Patent Document 1: Japanese PCT Publication No. 2007-502544 [0004] However, if the number of metal wires in the power module increases due to the diver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/49
CPCH01L25/072H01L24/49H01L2224/491H01L2224/48472H01L2224/48137H01L2224/49175H01L2224/49052H01L2224/49111H01L2224/49431H01L2224/49433H01L2224/73265H01L2224/32225H01L2924/19107H01L2224/0603H01L2224/4903H01L23/49861H01L23/24H01L23/053H01L2224/32227H01L2224/48227H01L2224/48247H01L2224/8384H01L2224/29339H01L2224/29347H01L2224/45014H01L2224/45015H01L2924/181H01L2224/49171H01L24/48H01L24/29H01L24/32H01L24/45H01L2924/10272H01L2224/49176H01L2224/06181H01L2224/48091H01L2224/48177H01L2924/3862H01L2224/49097H01L24/06H01L2924/00014H01L2224/291H01L2224/45099H01L2924/00012H01L2924/014H01L2924/1425H01L2924/30107
Inventor 近藤聪藤野纯司松井智香
Owner MITSUBISHI ELECTRIC CORP