Flip chip type light emitting diode chip and light emitting device including the same
A technology of light-emitting diodes and chips, which is applied to semiconductor devices of light-emitting elements, lighting devices, light sources, etc., can solve the problems of reduced reflectivity of metal reflective layers, large light loss, low reflectivity of metal reflective layers, etc., and achieve improved stability high performance and electrical stability
Active Publication Date: 2022-07-29
SEOUL VIOSYS CO LTD
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Problems solved by technology
However, the reflectivity of metal reflective layer is relatively low, so it produces very large light loss
Furthermore, there will be a problem that the reflectivity of the metal reflective layer will decrease due to the long-term use of the light-emitting diode.
Method used
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[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments introduced below are provided as examples in order to sufficiently convey the idea of the present invention to those skilled in the technical field to which the present invention pertains. Therefore, the present invention is not limited to the examples described below, and can be embodied in other embodiments. In addition, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. In addition, when it is described that one component is located "on top" or "above" of another component, not only the case where each part is located "right above" or "directly above" the other component, but also the case where each component is located A case where another component is interposed between an element and another component. Throughout the specification, the same reference signs denote the s...
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Abstract
The present invention provides a light emitting diode chip and a light emitting device having the same. The light emitting diode chip of an embodiment includes: a first conductive type semiconductor layer; a mesa, disposed on a part of the first conductive type semiconductor layer, including an active layer and a second conductive type semiconductor layer; a transparent electrode, ohmically connected to the second conductive type semiconductor layer on the conductive type semiconductor layer; the first current spreader, ohmically contacted to the first conductive type semiconductor layer; the second current spreader, electrically connected to the transparent electrode; the insulating layer, covering the mesa, the first current spreader and the second current spreader a distributed Bragg reflector; and a first pad electrode and a second pad electrode, located on the insulating layer, connected to the first current spreader and the second current spreader, respectively; and the first current spreader and the mesa The lateral separation distance between them is greater than the thickness of the insulating layer, and one side surface of the first current spreader near the mesa side is longer than the other side surface.
Description
technical field [0001] The present invention relates to a flip chip type light emitting diode chip and a light emitting device including the same. Background technique [0002] Light-emitting diodes are used in various products such as large backlight units (Back Light Unit, BLU), general lighting and electronic equipment, and are also used in various small home appliances and interior decoration products. Furthermore, light emitting diodes are not only used simply as light sources, but can also be used for various purposes such as the purpose of conveying information and evoking a sense of beauty. [0003] On the other hand, in order to provide high-efficiency light-emitting diodes, flip-chip type light-emitting diodes are generally fabricated. Flip-chip light-emitting diodes have excellent heat dissipation performance, and can use a reflective layer to improve light extraction efficiency. In addition, using the flip-chip bonding technology, wiring can be omitted, thereby...
Claims
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IPC IPC(8): H01L33/10H01L33/14H01L33/20H01L33/36H01L33/38
CPCH01L33/14H01L33/20H01L33/36H01L33/46H01L33/38H01L33/42H01L33/62H01L33/10H01L33/24F21Y2115/10F21K9/232
Inventor 李珍雄金京完李锦珠
Owner SEOUL VIOSYS CO LTD