VCSEL array, manufacturing method thereof, flat-top far-field generation method and lighting module

Abstract

The invention provides a VCSEL array, a manufacturing method thereof, a flat-top far-field generation method and a lighting module. Compared with a traditional VCSEL array, the VCSEL array of the invention can easily achieve a uniform flat-topped far field without arranging optical elements such as a diffuser, so that the cost of the array and the corresponding module is remarkably reduced while the requirements of TOF measurement and the like are well met. The elimination of the diffuser makes a corresponding sidewall column, a diffuser cover and other components omitted, so the thickness ofthe module is obviously reduced, and the module has multiple advantages which do not exist in the prior art.

Description

technical field [0001] The invention relates to the technical field of vertical cavity surface emitting lasers (VCSEL), in particular to a lensless VCSEL unit and a corresponding illumination field generation method. Background technique [0002] At present, in many smart devices such as smart phones, there is a huge market demand for flat-top infrared illumination (IR) projection modules, which play a vital role in specific applications such as TOF measurement and security camera equipment. The vertical cavity surface emitting laser (VCSEL) is the core device in the flat-top infrared illumination projection module. [0003] Existing flat-top infrared lighting projection modules generally include a combination of VCSEL arrays and optical devices such as diffusers in structure. The emission hole of a typical VCSEL array is usually rectangular or circular, and the spatial light distribution (far field) is usually Gaussian or circular. This kind of far field is non-uniform and...

AI Technical Summary

Problems solved by technology

The above-mentioned existing module structure, due to the arrangement of optical devices such as diffusers, on the one hand has extremely strict requirements on the precision of assembly between the components, which increases the complexity of the structure and production process, and at the same time for Supporting this optical system also requires a rigid frame with sidewalls to support the VCSEL array and optics to provide a minimum spacing (typically 0.3-0.5mm) between the two components, and the total thickness of the module is usually close to 1mm , and ultimately make it difficult to further reduce the thickness and volume of mobile phones and other devices that it is specifically applied to

Images