Modularized sealed device for preparing film through spatial isolation atomic layer deposition

Abstract

The invention belongs to the related field of micro and nano fabrication, and particularly discloses a modularized sealed device for preparing a film through spatial isolation atomic layer deposition.The device comprises a moving device, a spray head device, a sealing device and a reaction device, wherein the moving device is used for driving the sealing device and the reaction device to move along a horizontal rail and driving the spray head device to move in the vertical direction; a sealing cavity of the spray head device is connected with a lifting table; a sealing cavity cover plate is fixed above the sealing cavity; a modularized spray head is fixed below the sealing cavity; the sealing device and the spray head device are in sealing fit; and the reaction device is arranged below the spray head device to do reciprocating motion to realize the spatial isolation atomic layer deposition. The reaction device is arranged below the spray head device to do reciprocating motion to realize spatial isolation atomic layer deposition; and when atomic layer deposition is not performed, the sealing device is moved to a part below the spray head device to seal the spray head device to ensure the vacuum degree of the spray head device so as to realize the modularized sealing.

Description

technical field [0001] The invention belongs to the field related to micro-nano manufacturing, and more specifically relates to a modular sealed space-isolated atomic layer deposition thin film equipment. Background technique [0002] With the continuous development of semiconductor technology, the packaging requirements for the surface of materials in solar panels, flexible electronics and other fields are also increasing. ALD, or Atomic Layer Deposition, is a method that can coat substances layer by layer on the surface of a substrate in the form of a monoatomic film. Although this atomic layer deposition process has similarities with ordinary chemical deposition, in the process of atomic layer deposition, the chemical reaction of a new layer of atomic film is directly related to the previous layer. This way makes each reaction only A layer of atoms can be deposited. [0003] ALD is attracting increasing attention because of its wide range of applications and the excelle...

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Problems solved by technology

[0004] However, there are still many problems in the development of SALD technology. First, some inventions have not discarded the high vacuum chamber used in traditional ALD. The purpose is to ensure the quality of the deposition environment and prevent water and other pollution in the air under normal pressure. Second, although some inventions abandon the high-vacuum chamber, it is difficult to achieve effective isolation because it is in an open environment and there is no other means of protection. The isolation here includes the isolation between precursors , including isolation of impurities in the air from the reaction zone

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