Low-melting-point metal phase change heat conduction device

Abstract

The invention relates to a low-melting-point metal phase change heat conduction device. The heat conduction device comprises a shell, wherein a low-melting-point metal body is arranged in the shell, avacuum cavity is formed in the shell, the low-melting-point metal body is arranged in the vacuum cavity, and the vacuum cavity further comprises a vacuum part besides a part of the volume occupied bythe low-melting-point metal body. On one hand, heat conductivity of metal is higher than that of gas and liquid, so the better heat conduction effect can be obtained; on the other hand, the volume change of the low-melting-point metal body is not large when the low-melting-point metal body is changed from a solid phase to a liquid phase, which is superior to huge pressure brought by huge volume change of traditional liquid vaporization, so structural stability is enhanced, and shell deformation and even accidents caused by cold and heat change are avoided; on the other hand, directivity cannot be generated due to gravity in the utilization process, and an inversion problem of traditional liquid vaporization is avoided; on the other hand, a problem of drainage return of condensed liquid isavoided, a micro pump or a capillary tube does not need to be designed, and simple structure and low cost are achieved.

Description

[0001] This application claims the priority of the Chinese invention patent application filed on March 18, 2019 with the application number 201910202843.2 and the title "Low Melting Point Metal Phase Change Thermal Conduction Device". technical field [0002] The application relates to the field of heat dissipation, in particular to a low-melting-point metal phase-change thermal conduction device. Background technique [0003] With the rapid development of high-density semiconductor and high-integration semiconductor technology, the heat dissipation of semiconductor devices has become a major technical problem in the industry. [0004] The key device for the heat dissipation of semiconductor devices is the heat conduction device. At present, heat conduction devices in the industry are mainly divided into the following two categories: [0005] 1. Direct heat conduction: Directly fix the semiconductor heating device on the copper base or ceramic substrate, and use the high th...

AI Technical Summary

Problems solved by technology

However, because the liquid is affected by gravity, the heat conduction in this way will have a certain direction; It sinks at the bottom of the inner cavity of the heat dissipation pipe of the radiator, that is to say, the section of the inner cavity of the radiator close to the heat source is vacuum and there is no liquid; then when dissipating heat, the heat source transfers heat to the liquid through the radiator, and the liquid When heated, it volatilizes to the section near the heat source in the inner cavity of the radiator. What the steam encounters is not the temperature of the outside atmosphere, but the temperature of the heat source. It will not condense and flow back, so the heat cannot be transferred to the heat dissipation fins for heat dissipation. Realize the cooling cycle in which the gas returns to liquid after cooling and condensation. At the same time, due to the poor thermal conductivity of the gas, the heat dissipation function of the heat conduction medium in the heat dissipation pipe is invalid; in addition, after the liquid is vaporized, the pressure in the heat dissipation pipe is extremely high. Larger, the heat dissipation pipe tends to expand and thicken. Since the heat dissipation fins are hooped on the outer periphery of the heat dissipation pipe, when the heat dissipation pipe expands, the heat dissipation pipe will expand the joints on the heat dissipation fins. After cooling , the heat dissipation pipe shrinks back to the original size, but the connection on the heat dissipation fin cannot shrink, then the connection between the heat dissipation pipe and the heat dissipation fin will have a gap or even loosen, resulting in partial contact or complete separation of the heat dissipation pipe and the heat dissipation fin. As a result, the heat on the heat dissipation pipe cannot be volatilized into the outside atmosphere through the heat dissipation fins, and it also causes hidden dangers in the connection

Images