Electronic element mounting base convenient for heat dissipation

Abstract

The invention discloses an electronic component mounting base convenient for heat dissipation. The mounting base comprises a mounting base main body, and a through hole is formed in the surface of thetop of the mounting base main body, and penetrates through the mounting base main body; a check ring is mounted on the surface of the side wall of an inner cavity of the through hole; a limiting column is arranged on the surface of the top of the check ring; a hollowed-out plate is mounted on the surface of the top of the limiting column; a limiting groove is formed in the surface of the hollow plate; a fixed frame is mounted on one side of the bottom of the check ring; and cooling fans are mounted in an inner cavity of the fixed frame. According to the invention, a plurality of groups of cooling fans are arranged in the fixed frame; the bottom of the hollow plate can be cooled; holes are formed in the surface of the hollow plate; and meanwhile, the damping springs can reduce the influence of vibration generated during operation of the cooling fans on the mounting base main body, the depth of the supporting legs inserted into the sleeves can be flexibly adjusted through the screw holes and the bolts, and therefore, an operator can flexibly adjust and use the mounting base conveniently according to his/her own needs.

Description

technical field [0001] The invention relates to the technical field of mounting seat equipment, in particular to a mounting seat for electronic components that facilitates heat dissipation. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.), or groups of varying complexity, such as integrated circuits (op amps, resistors, logic gates, etc.). [0003] However, there are following disadvantages in existing mounts for electronic components: [0004] 1. When the existing mounting base for...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a mounting seat for electronic components that is convenient for heat dissipation, so as to solve the problem that the existing mounting base for electronic components in the above-mentioned background technology cannot flexibly install the electronic components due to its insufficient heat dissipation function when in use. For heat dissipation treatment, special heat dissipation tools are required to assist, which increases the economic expenditure of the enterprise, and the existing electronic component mounts cannot be adjusted flexibly, so that the operator is comfortable when working, and thus increases the operating cost. staff workload

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