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Storage and transportation device used for semiconductor chips and use method thereof

A transportation device and semiconductor technology, which is applied in the direction of transportation and packaging, containers to prevent mechanical damage, containers, etc., can solve the problems of easy pick-and-place operation, chip surface wear, and inconvenient storage of semiconductor chips, so as to avoid collision damage and improve static friction Power, realize the effect of interconnection and interactive operation between devices

Active Publication Date: 2020-01-17
杭州翔毅科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a storage and transportation device for semiconductor wafers, so as to solve the problems in the prior art that semiconductor wafers are inconvenient to store, and the pick-and-place operation is easy to cause wear on the wafer surface

Method used

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  • Storage and transportation device used for semiconductor chips and use method thereof
  • Storage and transportation device used for semiconductor chips and use method thereof
  • Storage and transportation device used for semiconductor chips and use method thereof

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] see Figures 1 to 6 , the present invention provides a technical solution: a storage and transportation device for semiconductor wafers, including a frame body 1, a storage mechanism for placing semiconductor wafers, a dust suction mechanism for cleaning the surface of the storage mechanism, and a control The control device for the operation of the storage mechanism and the dust suction mechanism. The storage mechanism includes two symmetrically arrange...

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Abstract

The invention relates to the technical field of semiconductor production equipment, in particular to a storage and transportation device used for semiconductor chips. The device comprises a frame body, a placing mechanism for placing the semiconductor chips, dust collection mechanisms used for cleaning the surface of the placing mechanism and a control device for controlling the placing mechanismand the dust collection mechanisms to run. The placing mechanism comprises two symmetric placing shelves and lifting mechanisms mounted on the placing shelves. The two dust collection mechanisms are arranged on the frame body and correspond to corresponding skins to be arranged in a matched manner, and each dust collection mechanism comprises a push cylinder, a sliding block, a brush body and a second electromagnetic valve. The device can be used for placing of the semiconductor chips, and the wear to the semiconductor chips can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, and the specific field is a storage and transportation device for semiconductor wafers and a use method thereof. Background technique [0002] During the processing and production of semiconductor wafers, they are stored, transferred and transported by transfer devices. However, most of the current semiconductor wafer racks are single-layer, so that each rack can only place one semiconductor substrate, resulting in low substrate conveying efficiency on the conveyor belt. Moreover, most of the racks are open. In the field of semiconductors, it is necessary to ensure the purity of the substrate surface to avoid particle contamination of the substrate by attaching tiny particles to the substrate. This makes the open rack easy to increase the particle size of the substrate surface during the transfer of the substrate. In addition, in the process of picking and placing the w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/05
CPCB65D81/05
Inventor 王华珍
Owner 杭州翔毅科技有限公司
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