Precision etching device for flexible circuit board

Abstract

The invention provides a precision etching device for a flexible circuit board. The device comprises a main tank, a siphon part, a spraying part and a liquid absorption part; the siphon part comprisesa siphon; one end of the siphon is connected with a siphon working pump; one end of the siphon is connected with the liquid suction part through a liquid suction connecting hose; the liquid suction part comprises a liquid suction pipe; the liquid suction pipe is connected with the siphon through the liquid suction connecting hose; the spraying part comprises an upper main spraying pipe; one end of the upper main spraying pipe is connected with a spraying working pump, and the other end of the upper main spraying pipe is connected with multiple upper spraying pipes; the upper spraying pipes and the liquid suction pipe are located in the main tank; and the siphon pipe, the siphon working pump, the spraying working pump and the upper spraying main pipe are located outside the main tank. Theprecision etching device for the flexible circuit board has the advantages of uniform liquid solution spraying, high etching uniformity, high etching factor and capability of achieving the etching ofan ultrathin substrate and an ultrafine circuit and avoiding board clamping.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board etching, in particular to a flexible circuit board precision etching device. Background technique [0002] With the development of industry, printed circuit boards are developing in the direction of multi-layer, densification and flexibility. The lines are getting thinner and the thickness of the substrate is getting thinner and thinner. When it is less than 0.050mm, the thin plate cannot pass through, and it is difficult to etch the circuit board with fine lines below 50um. Contents of the invention [0003] The invention provides a flexible circuit board precision etching device capable of spraying liquid medicine evenly, enabling a thin plate of 0.036 mm to pass smoothly without jamming, and capable of producing ultra-fine lines of 30um to 50um. [0004] The present invention can be realized through the following technical solutions: [0005] A precision etching device for a ...

AI Technical Summary

Problems solved by technology

[0002] With the development of industry, printed circuit boards are developing in the direction of multi-layer, densification and flexibility. The lines are getting thinner and the thickness of the substrate is getting thinner and thinner. When it is less than 0.050mm, the thin plate cannot pass through, and it is difficult to etch the circuit board with fine lines below 50um

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